Integrated ultrasonic imaging systems based on CMUT arrays: Recent progress
dc.contributor.author | Wygant, Ira O. | en_US |
dc.contributor.author | Zhuang, Xuefeng | en_US |
dc.contributor.author | Yeh, David T. | en_US |
dc.contributor.author | Nikoozadeh, Amin | en_US |
dc.contributor.author | Oralkan, Ömer | en_US |
dc.contributor.author | Ergün, Arif Sanlı | en_US |
dc.contributor.author | Karaman, Mustafa | en_US |
dc.contributor.author | Khuri-Yakub, Butrus Thomas | en_US |
dc.date.accessioned | 2019-08-31T12:10:23Z | |
dc.date.accessioned | 2019-08-05T16:05:06Z | |
dc.date.available | 2019-08-31T12:10:23Z | |
dc.date.available | 2019-08-05T16:05:06Z | |
dc.date.issued | 2004 | |
dc.department | Işık Üniversitesi, Mühendislik Fakültesi, Elektrik-Elektronik Mühendisliği Bölümü | en_US |
dc.department | Işık University, Faculty of Engineering, Department of Electrical-Electronics Engineering | en_US |
dc.description.abstract | This paper describes the development of an ultrasonic imaging system based on a two-dimensional capacitive micromachined ultrasonic transducer (CMUT) array. The transducer array and front-end electronics are designed to fit in a 5-mm endoscopic channel. A custom-designed integrated circuit, which comprises the front-end electronics, will be connected with the transducer elements via through-wafer interconnects and flip-chip bonding. FPGA-based signal-processing hardware will provide real-time three-dimensional imaging. The imaging system is being developed to demonstrate a means of integrating the front-end electronics with the transducer array and to provide a clinically useful technology. Integration of the electronics can improve signal-to-noise ratio, reduce the number of cables connecting the imaging probe to a separate processing unit, and provide a means of connecting electronics to large two-dimensional transducer arrays. This paper describes the imaging system architecture and the progress we have made on implementing each of its components: a 16×16 CMUT array, custom-designed integrated circuits, a flip-chip bonding technique, and signal-processing hardware. | en_US |
dc.description.version | Publisher's Version | en_US |
dc.identifier.citation | Wygant, I. O., Zhuang, X., Yeh, D. T., Nikoozadeh, A., Oralkan, O., Ergün, A. S., . . . Khuri-Yakub, B. T. (2004). Integrated ultrasonic imaging systems based on CMUT arrays: Recent progress. Paper presented at the, 1, 391-394. doi:10.1109/ULTSYM.2004.1417745 | en_US |
dc.identifier.endpage | 394 | |
dc.identifier.isbn | 078038413X | |
dc.identifier.isbn | 0780384121 | |
dc.identifier.issn | 1051-0117 | en_US |
dc.identifier.scopus | 2-s2.0-21644441603 | en_US |
dc.identifier.scopusquality | N/A | en_US |
dc.identifier.startpage | 391 | |
dc.identifier.uri | https://hdl.handle.net/11729/2044 | |
dc.identifier.uri | https://dx.doi.org/10.1109/ULTSYM.2004.1417745 | |
dc.identifier.volume | 1 | |
dc.identifier.wos | WOS:000228557207093 | en_US |
dc.identifier.wosquality | N/A | en_US |
dc.indekslendigikaynak | Web of Science | en_US |
dc.indekslendigikaynak | Scopus | en_US |
dc.indekslendigikaynak | Conference Proceedings Citation Index – Science (CPCI-S) | en_US |
dc.institutionauthor | Karaman, Mustafa | en_US |
dc.language.iso | en | en_US |
dc.peerreviewed | Yes | en_US |
dc.publicationstatus | Published | en_US |
dc.publisher | IEEE | en_US |
dc.relation.ispartof | Proceedings - IEEE Ultrasonics Symposium | en_US |
dc.relation.ispartofseries | Ultrasonics Symposium | en_US |
dc.relation.publicationcategory | Konferans Öğesi - Uluslararası - Kurum Öğretim Elemanı | en_US |
dc.rights | info:eu-repo/semantics/closedAccess | en_US |
dc.subject | 5 mm | en_US |
dc.subject | Array signal processing | en_US |
dc.subject | Arrays | en_US |
dc.subject | Biomedical ultrasonics | en_US |
dc.subject | Bonding | en_US |
dc.subject | Bonding processes | en_US |
dc.subject | Cables | en_US |
dc.subject | Capacitative micromachined ultrasonic transducer (CMUT) | en_US |
dc.subject | Capacitive micromachined | en_US |
dc.subject | Capacitive micromachined ultrasonic transducer | en_US |
dc.subject | Capacitive micromachined ultrasonic transducer array | en_US |
dc.subject | Capacitive sensors | en_US |
dc.subject | CMUT | en_US |
dc.subject | CMUT arrays | en_US |
dc.subject | Custom-designed integrated circuit | en_US |
dc.subject | Data acquisition | en_US |
dc.subject | Electric potential | en_US |
dc.subject | Electronic equipment | en_US |
dc.subject | Endoscopic channel | en_US |
dc.subject | Field programmable gate arrays | en_US |
dc.subject | Flip-chip bonding | en_US |
dc.subject | Flip-chip devices | en_US |
dc.subject | FPGA-based signal-processing hardware | en_US |
dc.subject | Front-end electronics | en_US |
dc.subject | Hardware | en_US |
dc.subject | Image processing equipment | en_US |
dc.subject | Image reconstruction | en_US |
dc.subject | Imaging probe | en_US |
dc.subject | Integrated circuit design | en_US |
dc.subject | Integrated circuit interconnections | en_US |
dc.subject | Integrated ultrasonic imaging systems | en_US |
dc.subject | Integrated circuits | en_US |
dc.subject | Joining processes | en_US |
dc.subject | Microsensors | en_US |
dc.subject | Probes | en_US |
dc.subject | Real-time three-dimensional imaging | en_US |
dc.subject | Signal processing | en_US |
dc.subject | Signal to noise ratio | en_US |
dc.subject | Silicon nitride | en_US |
dc.subject | Stanford Medical School | en_US |
dc.subject | Systems integrated circuits | en_US |
dc.subject | Three-dimensional | en_US |
dc.subject | Three-dimensional systems | en_US |
dc.subject | Through-wafer interconnects | en_US |
dc.subject | Ultrasonic imaging | en_US |
dc.subject | Ultrasonic transducer arrays | en_US |
dc.subject | Ultrasonic transducers | en_US |
dc.subject | Ultrasonic transducer | en_US |
dc.title | Integrated ultrasonic imaging systems based on CMUT arrays: Recent progress | en_US |
dc.type | Conference Object | en_US |
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