Integrated ultrasonic imaging systems based on CMUT arrays: Recent progress

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dc.authorid0000-0001-8616-6877
dc.authorid0000-0002-6193-5761
dc.authorid0000-0003-3940-7898
dc.contributor.authorWygant, Ira O.en_US
dc.contributor.authorZhuang, Xuefengen_US
dc.contributor.authorYeh, David T.en_US
dc.contributor.authorNikoozadeh, Aminen_US
dc.contributor.authorOralkan, Ömeren_US
dc.contributor.authorErgün, Arif Sanlıen_US
dc.contributor.authorKaraman, Mustafaen_US
dc.contributor.authorKhuri-Yakub, Butrus Thomasen_US
dc.date.accessioned2019-08-31T12:10:23Z
dc.date.accessioned2019-08-05T16:05:06Z
dc.date.available2019-08-31T12:10:23Z
dc.date.available2019-08-05T16:05:06Z
dc.date.issued2004
dc.departmentIşık Üniversitesi, Mühendislik Fakültesi, Elektrik-Elektronik Mühendisliği Bölümüen_US
dc.departmentIşık University, Faculty of Engineering, Department of Electrical-Electronics Engineeringen_US
dc.description.abstractThis paper describes the development of an ultrasonic imaging system based on a two-dimensional capacitive micromachined ultrasonic transducer (CMUT) array. The transducer array and front-end electronics are designed to fit in a 5-mm endoscopic channel. A custom-designed integrated circuit, which comprises the front-end electronics, will be connected with the transducer elements via through-wafer interconnects and flip-chip bonding. FPGA-based signal-processing hardware will provide real-time three-dimensional imaging. The imaging system is being developed to demonstrate a means of integrating the front-end electronics with the transducer array and to provide a clinically useful technology. Integration of the electronics can improve signal-to-noise ratio, reduce the number of cables connecting the imaging probe to a separate processing unit, and provide a means of connecting electronics to large two-dimensional transducer arrays. This paper describes the imaging system architecture and the progress we have made on implementing each of its components: a 16×16 CMUT array, custom-designed integrated circuits, a flip-chip bonding technique, and signal-processing hardware.en_US
dc.description.versionPublisher's Versionen_US
dc.identifier.citationWygant, I. O., Zhuang, X., Yeh, D. T., Nikoozadeh, A., Oralkan, O., Ergün, A. S., . . . Khuri-Yakub, B. T. (2004). Integrated ultrasonic imaging systems based on CMUT arrays: Recent progress. Paper presented at the Proceedings - IEEE Ultrasonics Symposium, 1, 391-394. doi:10.1109/ULTSYM.2004.1417745en_US
dc.identifier.endpage394
dc.identifier.isbn078038413X
dc.identifier.isbn0780384121
dc.identifier.issn1051-0117
dc.identifier.scopus2-s2.0-21644441603
dc.identifier.scopusqualityN/A
dc.identifier.startpage391
dc.identifier.urihttps://hdl.handle.net/11729/2044
dc.identifier.urihttps://dx.doi.org/10.1109/ULTSYM.2004.1417745
dc.identifier.volume1
dc.identifier.wosWOS:000228557207093
dc.identifier.wosqualityN/A
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.indekslendigikaynakConference Proceedings Citation Index – Science (CPCI-S)en_US
dc.institutionauthorKaraman, Mustafaen_US
dc.language.isoenen_US
dc.peerreviewedYesen_US
dc.publicationstatusPublisheden_US
dc.publisherIEEEen_US
dc.relation.ispartofProceedings - IEEE Ultrasonics Symposiumen_US
dc.relation.ispartofseriesUltrasonics Symposiumen_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subject5 mmen_US
dc.subjectArray signal processingen_US
dc.subjectArraysen_US
dc.subjectBiomedical ultrasonicsen_US
dc.subjectBondingen_US
dc.subjectBonding processesen_US
dc.subjectCablesen_US
dc.subjectCapacitative micromachined ultrasonic transducer (CMUT)en_US
dc.subjectCapacitive micromachineden_US
dc.subjectCapacitive micromachined ultrasonic transduceren_US
dc.subjectCapacitive micromachined ultrasonic transducer arrayen_US
dc.subjectCapacitive sensorsen_US
dc.subjectCMUTen_US
dc.subjectCMUT arraysen_US
dc.subjectCustom-designed integrated circuiten_US
dc.subjectData acquisitionen_US
dc.subjectElectric potentialen_US
dc.subjectElectronic equipmenten_US
dc.subjectEndoscopic channelen_US
dc.subjectField programmable gate arraysen_US
dc.subjectFlip-chip bondingen_US
dc.subjectFlip-chip devicesen_US
dc.subjectFPGA-based signal-processing hardwareen_US
dc.subjectFront-end electronicsen_US
dc.subjectHardwareen_US
dc.subjectImage processing equipmenten_US
dc.subjectImage reconstructionen_US
dc.subjectImaging probeen_US
dc.subjectIntegrated circuit designen_US
dc.subjectIntegrated circuit interconnectionsen_US
dc.subjectIntegrated ultrasonic imaging systemsen_US
dc.subjectIntegrated circuitsen_US
dc.subjectJoining processesen_US
dc.subjectMicrosensorsen_US
dc.subjectProbesen_US
dc.subjectReal-time three-dimensional imagingen_US
dc.subjectSignal processingen_US
dc.subjectSignal to noise ratioen_US
dc.subjectSilicon nitrideen_US
dc.subjectStanford Medical Schoolen_US
dc.subjectSystems integrated circuitsen_US
dc.subjectThree-dimensionalen_US
dc.subjectThree-dimensional systemsen_US
dc.subjectThrough-wafer interconnectsen_US
dc.subjectUltrasonic imagingen_US
dc.subjectUltrasonic transducer arraysen_US
dc.subjectUltrasonic transducersen_US
dc.subjectUltrasonic transduceren_US
dc.titleIntegrated ultrasonic imaging systems based on CMUT arrays: Recent progressen_US
dc.typeConference Objecten_US
dspace.entity.typePublication

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