An integrated circuit with transmit beamforming and parallel receive channels for 3D ultrasound imaging: testing and characterization
Yükleniyor...
Dosyalar
Tarih
2007
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
IEEE
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
The cost and complexity of medical ultrasound imaging systems can be reduced by integrating the transducer array with an integrated circuit (IC). By incorporating some of the system's front-end electronics into an IC, bulky cables and costly system electronics can be eliminated. Here we present an IC for 3D intracavital imaging that requires few electrical connections but uses a large fraction of a 16x16-element 2D transducer array to transmit focused ultrasound. To simplify the receive and data acquisition electronics, only the 32 elements along the array diagonals are used as receivers. The IC provides a preamplifier for each receiving element. Each of the 224 transmitting elements is provided an 8-bit shift register, a comparator, and a 25-V pulser. To transmit, a global counter is incremented from 1 to 224; each pulser fires when its stored register value is equal to the global count value. Electrical testing of the fabricated IC shows that it works as designed. The IC was flip-chip bonded to a two-dimensional capacitive micromachined ultrasonic transducer (CMUT) array. A two-dimensional image of a wire target phantom was acquired.
Açıklama
This work was funded by NIH grant CA99059. National Semiconductor (Santa Clara, Ca) provided valuable circuit design support and fabricated the integrated circuits. Pac Tech USA Inc. (Santa Clara, Ca) provided solder-jetting and electroless Ni/Au bumping services. Work was performed in part at the Stanford Nanofabrication Facility (a member of the National Nanotechnology Infrastructure Network) which is supported by the National Science Foundation under Grant ECS-9731293, its lab members, and the industrial members of the Stanford Center for Integrated Systems
Anahtar Kelimeler
3D intracavital imaging, 3d ultrasound imaging, 8-bit shift register, Acoustic waves, Array signal processing, Arrays, Beamforming, Biomedical electronics, Biomedical imaging, Biomedical transducers, Biomedical ultrasonics, Cables, Capacitive micromachined ultrasonic transducer, Capacitive micromachined ultrasonic transducers, Circuit testing, Comparator, Comparators (circuits), Costs, Data acquisition electronics, Electric connectors, Electrical connections, Electrical testing, Electroacoustic transducers, Flip-chip bonded CMUT array, Focused ultrasounds, Global counters, Integrated circuit, Integrated circuit testing, Integrated circuits, Medical ultrasound imaging system, Medical imaging, Medical ultrasound imaging systems, Optoelectronic devices, Parallel receive channel, Phantoms, Preamplifier, Preamplifiers, Pre-amplifiers, Receive channels, Receiving elements, Shift registers, Sparse array, System electronics, Three dimensional, Transducer array, Transducer arrays, Transducers, Transmit beamforming, Two dimensional, Ultrasonic imaging, Ultrasonic transducer arrays, Ultrasonic transducers, Ultrasonic imaging, Ultrasonics, Voltage 25 V, Wire target phantom
Kaynak
2007 IEEE Ultrasonics Symposium Proceedings, Vols 1-6
WoS Q Değeri
N/A
Scopus Q Değeri
N/A
Cilt
Sayı
Künye
Wygant, I. O., Jamal, N. S., Lee, H. J., Nikoozadeh, A., Zhuang, X., Oralkan, Ö., . . . Khuri-Yakub, B. T. (2007). An integrated circuit with transmit beamforming and parallel receive channels for 3D ultrasound imaging: Testing and characterization. Paper presented at the 25-28. doi:10.1109/ULTSYM.2007.20
