Volumetric imaging using 2D capacitive micromachined ultrasonic transducer arrays (CMUTs): Initial results
Yükleniyor...
Dosyalar
Tarih
2002
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
IEEE
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
This paper presents the first volumetric images obtained using a 2D CMUT array with through-wafer via interconnects. An 8×16-element portion of a 32×64-element array flip-chip bonded onto a glass fanout chip was used in the experiments. This study experimentally demonstrates that 2D CMUT arrays can be fabricated with high yield using silicon micromachining processes, individual electrical connections can be provided using through-wafer interconnects, and the flip-chip bonding technique can be used to integrate the dense 2D arrays with electronic circuits for practical imaging applications.
Açıklama
Anahtar Kelimeler
2D capacitive US transducer arrays, 2D CMUT array, Bonding, Capacitive micromachined, Capacitive micromachined ultrasonic transducer, Data acquisition, Dense 2D arrays, Fabrication, Flip chip devices, Flip-chip bonding, Flip-chip devices, Glass fanout chip, Integrated circuit interconnections, Interconnections, Laboratories, Medical imaging, Micromachined ultrasonic transducer arrays, Micromachining, Phased arrays, Photolithography, Polysilicon, Si, Si micromachining processes, Silicon, Silicon wafers, Spatial resolution, Through-wafer via interconnects, Ultrasonic imaging, Ultrasonic transducer arrays, Ultrasonic transducers, Ultrasonic imaging, Volumetric imaging applications, Volumetric imaging
Kaynak
Proceedings of the IEEE Ultrasonics Symposium
WoS Q Değeri
N/A
Scopus Q Değeri
N/A
Cilt
2
Sayı
Künye
Oralkan, O., Ergün, A. S., Cheng, C.-H., Johnson, J. A., Karaman, M., Lee, T. H. & Khuri-Yakub, B. T. (2002). Volumetric imaging using 2D capacitive micromachined ultrasonic transducer arrays (CMUTs): Initial results. Paper presented at the , 2 1083-1086 vol.2. doi:10.1109/ULTSYM.2002.1192483
