Volumetric imaging using 2D capacitive micromachined ultrasonic transducer arrays (CMUTs): Initial results

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dc.authorid0000-0001-8616-6877
dc.authorid0000-0002-6193-5761
dc.authorid0000-0003-3940-7898
dc.contributor.authorOralkan, Ömeren_US
dc.contributor.authorErgün, Arif Sanlıen_US
dc.contributor.authorCheng, Ching-Hsiangen_US
dc.contributor.authorJohnson, Jeremy A.en_US
dc.contributor.authorKaraman, Mustafaen_US
dc.contributor.authorLee, Thomas H.en_US
dc.contributor.authorKhuri-Yakub, Butrus Thomasen_US
dc.date.accessioned2019-08-31T12:10:23Z
dc.date.accessioned2019-08-05T16:05:07Z
dc.date.available2019-08-31T12:10:23Z
dc.date.available2019-08-05T16:05:07Z
dc.date.issued2002
dc.departmentIşık Üniversitesi, Mühendislik Fakültesi, Elektrik-Elektronik Mühendisliği Bölümüen_US
dc.departmentIşık University, Faculty of Engineering, Department of Electrical-Electronics Engineeringen_US
dc.description.abstractThis paper presents the first volumetric images obtained using a 2D CMUT array with through-wafer via interconnects. An 8×16-element portion of a 32×64-element array flip-chip bonded onto a glass fanout chip was used in the experiments. This study experimentally demonstrates that 2D CMUT arrays can be fabricated with high yield using silicon micromachining processes, individual electrical connections can be provided using through-wafer interconnects, and the flip-chip bonding technique can be used to integrate the dense 2D arrays with electronic circuits for practical imaging applications.en_US
dc.description.versionPublisher's Versionen_US
dc.identifier.citationOralkan, O., Ergün, A. S., Cheng, C.-H., Johnson, J. A., Karaman, M., Lee, T. H. & Khuri-Yakub, B. T. (2002). Volumetric imaging using 2D capacitive micromachined ultrasonic transducer arrays (CMUTs): Initial results. Paper presented at the , 2 1083-1086 vol.2. doi:10.1109/ULTSYM.2002.1192483en_US
dc.identifier.endpage1086
dc.identifier.isbn0780375823
dc.identifier.issn1051-0117
dc.identifier.scopus2-s2.0-0036992266
dc.identifier.scopusqualityN/A
dc.identifier.startpage1083
dc.identifier.urihttps://hdl.handle.net/11729/2059
dc.identifier.urihttps://dx.doi.org/10.1109/ULTSYM.2002.1192483
dc.identifier.volume2
dc.identifier.wosWOS:000182111700242
dc.identifier.wosqualityN/A
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.indekslendigikaynakConference Proceedings Citation Index – Science (CPCI-S)en_US
dc.institutionauthorKaraman, Mustafaen_US
dc.language.isoenen_US
dc.peerreviewedYesen_US
dc.publicationstatusPublisheden_US
dc.publisherIEEEen_US
dc.relation.ispartofProceedings of the IEEE Ultrasonics Symposiumen_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subject2D capacitive US transducer arraysen_US
dc.subject2D CMUT arrayen_US
dc.subjectBondingen_US
dc.subjectCapacitive micromachineden_US
dc.subjectCapacitive micromachined ultrasonic transduceren_US
dc.subjectData acquisitionen_US
dc.subjectDense 2D arraysen_US
dc.subjectFabricationen_US
dc.subjectFlip chip devicesen_US
dc.subjectFlip-chip bondingen_US
dc.subjectFlip-chip devicesen_US
dc.subjectGlass fanout chipen_US
dc.subjectIntegrated circuit interconnectionsen_US
dc.subjectInterconnectionsen_US
dc.subjectLaboratoriesen_US
dc.subjectMedical imagingen_US
dc.subjectMicromachined ultrasonic transducer arraysen_US
dc.subjectMicromachiningen_US
dc.subjectPhased arraysen_US
dc.subjectPhotolithographyen_US
dc.subjectPolysiliconen_US
dc.subjectSien_US
dc.subjectSi micromachining processesen_US
dc.subjectSiliconen_US
dc.subjectSilicon wafersen_US
dc.subjectSpatial resolutionen_US
dc.subjectThrough-wafer via interconnectsen_US
dc.subjectUltrasonic imagingen_US
dc.subjectUltrasonic transducer arraysen_US
dc.subjectUltrasonic transducersen_US
dc.subjectUltrasonic imagingen_US
dc.subjectVolumetric imaging applicationsen_US
dc.subjectVolumetric imagingen_US
dc.titleVolumetric imaging using 2D capacitive micromachined ultrasonic transducer arrays (CMUTs): Initial resultsen_US
dc.typeConference Objecten_US
dspace.entity.typePublication

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