Design trade-offs and considerations for improving the PCB current carrying capacity in high power density power electronics applications

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dc.authorid0000-0001-6393-8299
dc.contributor.authorBüyükdeğirmenci, Veysel T.en_US
dc.contributor.authorKozarva, Ömer F.en_US
dc.contributor.authorMilletsever, Özgür C.en_US
dc.contributor.authorHava, Ahmet Masumen_US
dc.date.accessioned2022-09-01T12:12:37Z
dc.date.available2022-09-01T12:12:37Z
dc.date.issued2022-03-24
dc.departmentIşık Üniversitesi, Mühendislik Fakültesi, Elektrik-Elektronik Mühendisliği Bölümüen_US
dc.departmentIşık University, Faculty of Engineering, Department of Electrical-Electronics Engineeringen_US
dc.description.abstractThis paper investigates printed circuit board (PCB) design trade-offs and considerations to maximize the current carrying capacity of traces in PCB-based power electronics applications. Many existing designs rely on methodologies through empirical data presented by the outdated IPC-2152 standard. A design methodology to maximize the utilized PCB area and improve thermal performance is introduced. To assess this methodology, lumped parameter (LP) and finite element (FE) models are developed and computational fluid dynamics (CFD) simulations are carried out. Thermal via placement strategies are investigated and maximum allowable power dissipation on the PCB traces is calculated. Simulations and analyses are experimentally validated on a PCB-based 100kW three-phase three-level inverter. The that results show that the thermal and electrical models discussed in this paper have superior accuracy compared to traditional formulations.en_US
dc.description.versionPublisher's Versionen_US
dc.identifier.citationBüyükdeğirmenci, Veysel T., Kozarva, Ö. F., Milletsever, Ö. C. & Hava, A. M. (2022). Design trade-offs and considerations for improving the PCB current carrying capacity in high power density power electronics applications. Paper presented at the 2022 IEEE Applied Power Electronics Conference and Exposition (APEC), 1678-1685. doi:10.1109/APEC43599.2022.9773486en_US
dc.identifier.doi10.1109/APEC43599.2022.9773486
dc.identifier.endpage1685
dc.identifier.isbn9781665406888
dc.identifier.isbn9781665406895
dc.identifier.issn2470-6647
dc.identifier.issn1048-2334
dc.identifier.scopus2-s2.0-85131671578
dc.identifier.scopusqualityN/A
dc.identifier.startpage1678
dc.identifier.urihttps://hdl.handle.net/11729/4810
dc.identifier.urihttp://dx.doi.org/10.1109/APEC43599.2022.9773486
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.indekslendigikaynakConference Proceedings Citation Index – Science (CPCI-S)en_US
dc.institutionauthorHava, Ahmet Masumen_US
dc.institutionauthorid0000-0001-6393-8299
dc.language.isoenen_US
dc.peerreviewedYesen_US
dc.publicationstatusPublisheden_US
dc.publisherIEEEen_US
dc.relation.ispartof2022 IEEE Applied Power Electronics Conference and Exposition (APEC)en_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectIPC-2152en_US
dc.subjectPCB ampacityen_US
dc.subjectPCB design methodologiesen_US
dc.subjectPower electronicsen_US
dc.subjectThermal viasen_US
dc.subjectCommerceen_US
dc.subjectComputational fluid dynamicsen_US
dc.subjectDesignen_US
dc.subjectEconomic and social effectsen_US
dc.subjectAmpacityen_US
dc.subjectDesign methodologyen_US
dc.subjectDesign tradeoffen_US
dc.subjectPower-electronicsen_US
dc.subjectPrinted circuit board ampacityen_US
dc.subjectPrinted circuit board design methodologyen_US
dc.subjectPrinted circuit board designsen_US
dc.subjectPrinted circuit boardsen_US
dc.subjectPower system measurementsen_US
dc.subjectSemiconductor device measurementen_US
dc.subjectDensity measurementen_US
dc.subjectThermal resistanceen_US
dc.subjectComputational modelingen_US
dc.subjectCoolingen_US
dc.subjectDesign engineeringen_US
dc.subjectFinite element analysisen_US
dc.subjectPrinted circuit designen_US
dc.subjectPrinted circuitsen_US
dc.subjectThermal management (packaging)en_US
dc.subjectElectrical modelsen_US
dc.subjectThermal modelsen_US
dc.subjectPCB tracesen_US
dc.subjectMaximum allowable power dissipationen_US
dc.subjectComputational fluid dynamics simulationsen_US
dc.subjectThermal performanceen_US
dc.subjectUtilized PCB areaen_US
dc.subjectOutdated IPC-2152 standarden_US
dc.subjectEmpirical dataen_US
dc.subjectPCB-based power electronics applicationsen_US
dc.subjectCircuit board design trade-offsen_US
dc.subjectHigh power density power electronics applicationsen_US
dc.subjectPCB current carrying capacityen_US
dc.titleDesign trade-offs and considerations for improving the PCB current carrying capacity in high power density power electronics applicationsen_US
dc.typeConference Objecten_US

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