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Yayın Monolithic CMUT-on-CMOS integration for intravascular ultrasound applications(IEEE-INST Electrical Electronics Engineers Inc, 2011-12) Zahorian, Jaime S.; Hochman, Michael; Xu, Toby; Satır, Sarp; Gürün, Gökçe; Karaman, Mustafa; Değertekin, Fahrettin LeventOne of the most important promises of capacitive micromachined ultrasonic transducer (CMUT) technology is integration with electronics. This approach is required to minimize the parasitic capacitances in the receive mode, especially in catheter-based volumetric imaging arrays, for which the elements must be small. Furthermore, optimization of the available silicon area and minimized number of connections occurs when the CMUTs are fabricated directly above the associated electronics. Here, we describe successful fabrication and performance evaluation of CMUT arrays for intravascular imaging on custom-designed CMOS receiver electronics from a commercial IC foundry. The CMUT-on-CMOS process starts with surface isolation and mechanical planarization of the CMOS electronics to reduce topography. The rest of the CMUT fabrication is achieved by modifying a low-temperature micromachining process through the addition of a single mask and developing a dry etching step to produce sloped sidewalls for simple and reliable CMUT-to-CMOS interconnection. This CMUT-to-CMOS interconnect method reduced the parasitic capacitance by a factor of 200 when compared with a standard wire-bonding method. Characterization experiments indicate that the CMUT-on-CMOS elements are uniform in frequency response and are similar to CMUTs simultaneously fabricated on standard silicon wafers without electronics integration. Experiments on a 1.6-mm-diameter dual-ring CMUT array with a center frequency of 15 MHz show that both the CMUTs and the integrated CMOS electronics are fully functional. The SNR measurements indicate that the performance is adequate for imaging chronic total occlusions located 1 cm from the CMUT array.Yayın Front-end CMOS electronics for monolithic integration with CMUT arrays: Circuit design and initial experimental results(2008) Gürün, Gökçe; Qureshi, Muhammad Shakeel; Balantekin, Müjdat; Güldiken, Rasim Oytun; Zahorian, Jaime S.; Peng, Shengyu; Basu, Arindam; Karaman, Mustafa; Hasler, Paul E.; Değertekin, Fahrettin LeventThis paper discusses design of CMOS-ASICs for monolithic integration of CMUT arrays by post-CMOS fabrication. We describe design strategies for monolithic integration and demonstrate the advantages of CMUT-on-CMOS approach. On the same wafer, separate sets of IC cells are designed to interface different types of CMUT arrays for IVUS and ICE applications. Circuit topologies include resistive feedback transimpedance amplifiers on the receiver side, along with multiplexers and buffers. Gains and bandwidths of receiving amplifiers are optimized separately to fit different array specifications such as number of elements, element size and operation bandwidth. To drive CMUTs a high voltage pulser array is designed in the same 3.3V unmodified CMOS technology by combining existing technological layers in an unconventional way. CMUT arrays are then built on top of the custom made 8" wafer containing these circuits fabricated in a 0.35µm standard CMOS process. We present initial characterization of the CMO electronics and pulse-echo measurements obtained post-CMOS fabricated CMUT elements.Yayın Multiple annular ring capacitive micromachined ultrasonic transducer arrays for forward-looking intravascular ultrasound imaging catheters(American Society of Mechanical Engineers (ASME), 2007) Güldiken, Rasim Oytun; Zahorian, Jaime S.; Balantekin, Müjdat; Karaman, Mustafa; Değertekin, Fahrettin LeventWe investigate multiple-annular-ring CMUT array configuration for forward-looking intravascular ultrasound (FL-IVUS) imaging. This configuration has the potential for independent optimization of each ring and uses the silicon area more effectively without any particular drawback. We designed and fabricated a sample 1mm diameter dual annular ring CMUT test array which consists of 24 transmit and 32 receive elements. For imaging experiments, we designed IC chips that contain 8 transimpedance amplifiers, a multiplexer and a buffer. The real time-pulse echo experiments obtained with designed IC electronics show 26dB Signal to Noise Ratio (SNR) from a 3.5 mm away aluminum reflector in oil. This paper presents our first efforts in obtaining real time imaging with designed IC chips which is one step before CMUT on CMOS implementation.
