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Yayın Space, time, and iconicity in Turkish sign language (TID)(Estonian Academy Publishers, 2012) Arik, EnginMuch evidence points to the conclusion that temporal concepts are drawn primarily from the conceptualization of space. Sign languages provide a particularly suitable area for observing such a relationship since they employ a three-dimensional signing space as a major building block for articulation. This paper addresses spatial and temporal language in Turkish Sign Language (TID), which has a full-fledged grammar and a natural language used by the deaf community in Turkey. It investigates descriptions of static and dynamic spatial situations and expressions of time. Results showed mismatches between the axial information in the stimuli and the use of left-right and front-back axes in the signing space. Furthermore, results also showed that the temporal language did not always correlate with the deictic use of the front-back axis. Thus, these findings suggest that temporal language may only partially be derived from spatial language.Yayın Monolithic CMUT-on-CMOS integration for intravascular ultrasound applications(IEEE-INST Electrical Electronics Engineers Inc, 2011-12) Zahorian, Jaime S.; Hochman, Michael; Xu, Toby; Satır, Sarp; Gürün, Gökçe; Karaman, Mustafa; Değertekin, Fahrettin LeventOne of the most important promises of capacitive micromachined ultrasonic transducer (CMUT) technology is integration with electronics. This approach is required to minimize the parasitic capacitances in the receive mode, especially in catheter-based volumetric imaging arrays, for which the elements must be small. Furthermore, optimization of the available silicon area and minimized number of connections occurs when the CMUTs are fabricated directly above the associated electronics. Here, we describe successful fabrication and performance evaluation of CMUT arrays for intravascular imaging on custom-designed CMOS receiver electronics from a commercial IC foundry. The CMUT-on-CMOS process starts with surface isolation and mechanical planarization of the CMOS electronics to reduce topography. The rest of the CMUT fabrication is achieved by modifying a low-temperature micromachining process through the addition of a single mask and developing a dry etching step to produce sloped sidewalls for simple and reliable CMUT-to-CMOS interconnection. This CMUT-to-CMOS interconnect method reduced the parasitic capacitance by a factor of 200 when compared with a standard wire-bonding method. Characterization experiments indicate that the CMUT-on-CMOS elements are uniform in frequency response and are similar to CMUTs simultaneously fabricated on standard silicon wafers without electronics integration. Experiments on a 1.6-mm-diameter dual-ring CMUT array with a center frequency of 15 MHz show that both the CMUTs and the integrated CMOS electronics are fully functional. The SNR measurements indicate that the performance is adequate for imaging chronic total occlusions located 1 cm from the CMUT array.
