Broadband matching of PA-To-PCB interconnection for X-band wireless power transfer
Yükleniyor...
Dosyalar
Tarih
2019-08
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Institute of Electrical and Electronics Engineers Inc.
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Design and simulation of a microwave wideband microstrip unit element bandpass matching network is presented, potential use might be a broadband WPT (microwave wireless power transfer) application in X-band frequencies (8-12 GHz). The source of the main energy can be wind, fossil, tidal, solar, nuclear, hydro etc. and the main energy can be converted from DC to microwave energy which then can be transmitted via the proposed WPT circuit towards a few or a network of a multiple microwave harvester receivers located at a near or far field from the main source. In the work, a bandpass matching network (BPMN) composed of microstrip "unit elements (UEs)" is designed to operate along the whole X-band (8-12 GHz). Designed BPMN is excited by an X-band commercial PA (power amplifier) MMIC (monolithic microwave integrated circuit) packaged chip, and it is loaded by an X-band microstrip patch antenna. A bond wire soldered between the RF output pad of MMIC chip and the input pad of the BPMN has an equivalent LC parasitic impedance assumed to be the generator complex impedance that must be compensated in a typical matching problem. SRFT (simplified real frequency technique) is used in the design of the matching network that compensates the effect of bond wire and very good agreement found between the theoretical design and simulations done in MWO (AWR).
Açıklama
The author presents his gratitudes to Isik University for the encouragement of him to present the paper in the conference of PGSRET-2019 and also the financial support of him.
Anahtar Kelimeler
AWR, Bond wire, Broad band matching, Broadband WPT application, Broadband amplifiers, Broadband matching, Electric power system interconnection, Energy transfer, Equivalent LC parasitic impedance, Frequency 8.0 GHz to 12.0 GHz, Impedance, Inductive power transmission, Integrated circuit design, Integrated circuit packaging, Lead bonding, Microstrip, Microstrip antennas, Microstrip unit elements, Microwave amplifiers, Microwave antennas, Microwave circuits, Microwave energy, Microwave integrated circuits, Microwave power transmission, Microwave wideband microstrip UE BPMN, Microwave wireless power transfer, Microwaves, MMIC chip, MMIC power amplifiers, Monolithic microwave integrated circuit, Monolithic microwave integrated circuits, Multiple microwave harvester receivers, MWO, Optimization, PA-to-PCB interconnection, Power amplifier, Power amplifiers, Printed circuit interconnections, Radio, Resonant wireless, Simplified real frequency technique, Slot antennas, Soldering, SRFT, Tidal power, Unit element, Unit element bandpass matching network, Wideband amplifiers, Wire, Wireless power transfer, Wires, WPT circuit, X bands, X-band, X-band commercial PA MMIC, X-band frequencies, X-band microstrip patch antenna, X-band wireless power transfer
Kaynak
2019 International Conference on Power Generation Systems and Renewable Energy Technologies (PGSRET)
WoS Q Değeri
N/A
Scopus Q Değeri
N/A
Cilt
Sayı
Künye
Köprü, R. (2019). Broadband matching of PA-to-PCB interconnection for X-band wireless power transfer. Paper presented at the 2019 International Conference on Power Generation Systems and Renewable Energy Technologies (PGSRET), 116-121. doi:10.1109/PGSRET.2019.8882695
