Broadband matching of PA-To-PCB interconnection for X-band wireless power transfer

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dc.authorid0000-0002-6706-7352
dc.contributor.authorKöprü, Ramazanen_US
dc.date.accessioned2020-02-19T02:10:13Z
dc.date.available2020-02-19T02:10:13Z
dc.date.issued2019-08
dc.departmentIşık Üniversitesi, Mühendislik Fakültesi, Elektrik-Elektronik Mühendisliği Bölümüen_US
dc.departmentIşık University, Faculty of Engineering, Department of Electrical-Electronics Engineeringen_US
dc.descriptionThe author presents his gratitudes to Isik University for the encouragement of him to present the paper in the conference of PGSRET-2019 and also the financial support of him.en_US
dc.description.abstractDesign and simulation of a microwave wideband microstrip unit element bandpass matching network is presented, potential use might be a broadband WPT (microwave wireless power transfer) application in X-band frequencies (8-12 GHz). The source of the main energy can be wind, fossil, tidal, solar, nuclear, hydro etc. and the main energy can be converted from DC to microwave energy which then can be transmitted via the proposed WPT circuit towards a few or a network of a multiple microwave harvester receivers located at a near or far field from the main source. In the work, a bandpass matching network (BPMN) composed of microstrip "unit elements (UEs)" is designed to operate along the whole X-band (8-12 GHz). Designed BPMN is excited by an X-band commercial PA (power amplifier) MMIC (monolithic microwave integrated circuit) packaged chip, and it is loaded by an X-band microstrip patch antenna. A bond wire soldered between the RF output pad of MMIC chip and the input pad of the BPMN has an equivalent LC parasitic impedance assumed to be the generator complex impedance that must be compensated in a typical matching problem. SRFT (simplified real frequency technique) is used in the design of the matching network that compensates the effect of bond wire and very good agreement found between the theoretical design and simulations done in MWO (AWR).en_US
dc.description.sponsorshipInt Islam Univen_US
dc.description.sponsorshipGazi Univ, Tech Facen_US
dc.description.sponsorshipInt Islam Univ, Fac Engn & Technolen_US
dc.description.versionPublisher's Versionen_US
dc.identifier.citationKöprü, R. (2019). Broadband matching of PA-to-PCB interconnection for X-band wireless power transfer. Paper presented at the 2019 International Conference on Power Generation Systems and Renewable Energy Technologies (PGSRET), 116-121. doi:10.1109/PGSRET.2019.8882695en_US
dc.identifier.doi10.1109/PGSRET.2019.8882695
dc.identifier.endpage121
dc.identifier.isbn9781728123011
dc.identifier.isbn9781728123004
dc.identifier.isbn9781728123028
dc.identifier.scopus2-s2.0-85074955669
dc.identifier.scopusqualityN/A
dc.identifier.startpage116
dc.identifier.urihttps://hdl.handle.net/11729/2250
dc.identifier.urihttps://dx.doi.org/10.1109/PGSRET.2019.8882695
dc.identifier.wosWOS:000611393300021
dc.identifier.wosqualityN/A
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.indekslendigikaynakConference Proceedings Citation Index – Science (CPCI-S)en_US
dc.institutionauthorKöprü, Ramazanen_US
dc.institutionauthorid0000-0002-6706-7352
dc.language.isoenen_US
dc.peerreviewedYesen_US
dc.publicationstatusPublisheden_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.relation.ispartof2019 International Conference on Power Generation Systems and Renewable Energy Technologies (PGSRET)en_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectAWRen_US
dc.subjectBond wireen_US
dc.subjectBroad band matchingen_US
dc.subjectBroadband WPT applicationen_US
dc.subjectBroadband amplifiersen_US
dc.subjectBroadband matchingen_US
dc.subjectElectric power system interconnectionen_US
dc.subjectEnergy transferen_US
dc.subjectEquivalent LC parasitic impedanceen_US
dc.subjectFrequency 8.0 GHz to 12.0 GHzen_US
dc.subjectImpedanceen_US
dc.subjectInductive power transmissionen_US
dc.subjectIntegrated circuit designen_US
dc.subjectIntegrated circuit packagingen_US
dc.subjectLead bondingen_US
dc.subjectMicrostripen_US
dc.subjectMicrostrip antennasen_US
dc.subjectMicrostrip unit elementsen_US
dc.subjectMicrowave amplifiersen_US
dc.subjectMicrowave antennasen_US
dc.subjectMicrowave circuitsen_US
dc.subjectMicrowave energyen_US
dc.subjectMicrowave integrated circuitsen_US
dc.subjectMicrowave power transmissionen_US
dc.subjectMicrowave wideband microstrip UE BPMNen_US
dc.subjectMicrowave wireless power transferen_US
dc.subjectMicrowavesen_US
dc.subjectMMIC chipen_US
dc.subjectMMIC power amplifiersen_US
dc.subjectMonolithic microwave integrated circuiten_US
dc.subjectMonolithic microwave integrated circuitsen_US
dc.subjectMultiple microwave harvester receiversen_US
dc.subjectMWOen_US
dc.subjectOptimizationen_US
dc.subjectPA-to-PCB interconnectionen_US
dc.subjectPower amplifieren_US
dc.subjectPower amplifiersen_US
dc.subjectPrinted circuit interconnectionsen_US
dc.subjectRadioen_US
dc.subjectResonant wirelessen_US
dc.subjectSimplified real frequency techniqueen_US
dc.subjectSlot antennasen_US
dc.subjectSolderingen_US
dc.subjectSRFTen_US
dc.subjectTidal poweren_US
dc.subjectUnit elementen_US
dc.subjectUnit element bandpass matching networken_US
dc.subjectWideband amplifiersen_US
dc.subjectWireen_US
dc.subjectWireless power transferen_US
dc.subjectWiresen_US
dc.subjectWPT circuiten_US
dc.subjectX bandsen_US
dc.subjectX-banden_US
dc.subjectX-band commercial PA MMICen_US
dc.subjectX-band frequenciesen_US
dc.subjectX-band microstrip patch antennaen_US
dc.subjectX-band wireless power transferen_US
dc.titleBroadband matching of PA-To-PCB interconnection for X-band wireless power transferen_US
dc.typeConference Objecten_US
dspace.entity.typePublication

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