Volumetric ultrasound imaging using 2-D CMUT arrays

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dc.authorid0000-0001-8616-6877
dc.authorid0000-0002-6193-5761
dc.authorid0000-0003-2424-6219
dc.authorid0000-0003-3940-7898
dc.contributor.authorOralkan, Ömeren_US
dc.contributor.authorErgün, Arif Sanlıen_US
dc.contributor.authorCheng, Ching-Hsiangen_US
dc.contributor.authorJohnson, Jeremy A.en_US
dc.contributor.authorKaraman, Mustafaen_US
dc.contributor.authorH. Lee, Thomasen_US
dc.contributor.authorKhuri-Yakub, Butrus Thomasen_US
dc.date.accessioned2015-01-15T22:59:58Z
dc.date.available2015-01-15T22:59:58Z
dc.date.issued2003-11
dc.departmentIşık Üniversitesi, Mühendislik Fakültesi, Elektrik-Elektronik Mühendisliği Bölümüen_US
dc.departmentIşık University, Faculty of Engineering, Department of Electrical-Electronics Engineeringen_US
dc.descriptionManuscript received December 17, 2002; accepted May 30, 2003. This work was supported by the United States Office of Naval Research and CBYON, Inc.en_US
dc.description.abstractRecently, capacitive micromachined ultrasonic transducers (CMUTs) have emerged as a candidate to overcome the difficulties in the realization of 2-D arrays for real-time 3-D imaging. In this paper, we present the first volumetric images obtained using a 2-D CMUT array. We have fabricated a 128 x 128-element 2-D CMUT array with through-wafer via interconnects and a 420-mum element pitch. As an experimental prototype, a 32 x 64-element portion of the 128 X 128-element array was diced and flip-chip bonded onto a glass fanout chip. This chip provides individual leads from a central 16 X 16-element portion of the array to surrounding bondpads. An 8 x 16-element poition of the array was used in the experiments along with a 128-channel data acquisition system. For imaging phantoms, we used a 2.37-mm diameter steel sphere located 10 mm from the array center and two 12-mm-thick Plexiglas plates located 20 mm and 60 mm from the array. A 4 X 4 group of elements in the middle of the 8 X 16-element array was used in transmit, and the remaining elements were used to receive the echo signals. The echo signal obtained from the spherical target presented a frequency spectrum centered at 4.37 MHz with a 100% fractional bandwidth, whereas the frequency spectrum for the echo signal from the parallel plate phantom was centered at 3.44 MHz with a 91% fractional bandwidth. The images were reconstructed by using RF beamforming and synthetic phased array approaches and visualized by surface rendering and multiplanar slicing techniques. The image of the spherical target has been used to approximate the point spread function of the system and is compared with theoretical expectations. This study experimentally demonstrates that 2-D CMUT arrays can be fabricated with high yield using silicon IC-fabrication processes, individual electrical connections can be provided using through-wafer vias, and flip-chip bonding can be used to integrate these dense 2-D arrays with electronic circuits for practical 3-D imaging applications.en_US
dc.description.sponsorshipUnited States Office of Naval Researchen_US
dc.description.versionPublisher's Versionen_US
dc.identifier.citationOralkan, O., Ergün, A. S., Cheng, C., Johnson, J. A., Karaman, M., Lee, T. H. & Khuri-Yakub, B. T. (2003). Volumetric ultrasound imaging using 2-D CMUT arrays. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 50(11), 1581-1594. doi:10.1109/TUFFC.2003.1251142en_US
dc.identifier.doi10.1109/TUFFC.2003.1251142
dc.identifier.endpage1594
dc.identifier.issn0885-3010
dc.identifier.issn1525-8955
dc.identifier.issue11
dc.identifier.pmid14682642
dc.identifier.scopus2-s2.0-0442279547
dc.identifier.scopusqualityQ1
dc.identifier.startpage1581
dc.identifier.urihttps://hdl.handle.net/11729/124
dc.identifier.urihttp://dx.doi.org/10.1109/TUFFC.2003.1251142
dc.identifier.volume50
dc.identifier.wosWOS:000187162500021
dc.identifier.wosqualityQ1
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.indekslendigikaynakPubMeden_US
dc.indekslendigikaynakScience Citation Index Expanded (SCI-EXPANDED)en_US
dc.institutionauthorKaraman, Mustafaen_US
dc.language.isoenen_US
dc.peerreviewedYesen_US
dc.publicationstatusPublisheden_US
dc.publisherIEEE-Inst Electrical Electronics Engineers Incen_US
dc.relation.ispartofIEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Controlen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subject2-Dimensional arraysen_US
dc.subjectTransducer arrayen_US
dc.subjectSystemen_US
dc.subjectVisualizationen_US
dc.subjectInterconnecten_US
dc.subjectFabricationen_US
dc.subjectGenerationen_US
dc.subjectDesignen_US
dc.subjectAlgorithmsen_US
dc.subjectEquipment failure analysisen_US
dc.subjectImage enhancementen_US
dc.subjectImage interpretationen_US
dc.subjectComputer-assisteden_US
dc.subjectImaging, three-dimensionalen_US
dc.subjectNucleocapsid proteinsen_US
dc.subjectPhantoms, imagingen_US
dc.subjectTransducersen_US
dc.subjectUltrasonographyen_US
dc.subjectAcoustic arraysen_US
dc.subjectFlip chip devicesen_US
dc.subjectImage reconstructionen_US
dc.subjectMicroprocessor chipsen_US
dc.subjectOptical transfer functionen_US
dc.subjectSemiconductor device manufactureen_US
dc.subjectTwo dimensionalen_US
dc.subjectUltrasonic transducersen_US
dc.subjectEAV nucleocapsid protein, Equine arteritis virusen_US
dc.subjectArticleen_US
dc.subjectComparative studyen_US
dc.subjectComputer assisted diagnosisen_US
dc.subjectEchographyen_US
dc.subjectEquipmenten_US
dc.subjectEvaluationen_US
dc.subjectImage qualityen_US
dc.subjectInstrumentationen_US
dc.subjectMethodologyen_US
dc.subjectThree dimensional imagingen_US
dc.subjectSynthetic phased array approachen_US
dc.subjectTwo dimensional capacitive micromachined ultrasonic transducersen_US
dc.subjectVolumetric ultrasound imagingen_US
dc.subjectUltrasonic imagingen_US
dc.titleVolumetric ultrasound imaging using 2-D CMUT arraysen_US
dc.typeArticleen_US
dspace.entity.typePublication

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