Integrated ultrasonic imaging systems based on CMUT arrays: Recent progress
Yükleniyor...
Dosyalar
Tarih
2004
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
IEEE
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
This paper describes the development of an ultrasonic imaging system based on a two-dimensional capacitive micromachined ultrasonic transducer (CMUT) array. The transducer array and front-end electronics are designed to fit in a 5-mm endoscopic channel. A custom-designed integrated circuit, which comprises the front-end electronics, will be connected with the transducer elements via through-wafer interconnects and flip-chip bonding. FPGA-based signal-processing hardware will provide real-time three-dimensional imaging. The imaging system is being developed to demonstrate a means of integrating the front-end electronics with the transducer array and to provide a clinically useful technology. Integration of the electronics can improve signal-to-noise ratio, reduce the number of cables connecting the imaging probe to a separate processing unit, and provide a means of connecting electronics to large two-dimensional transducer arrays. This paper describes the imaging system architecture and the progress we have made on implementing each of its components: a 16×16 CMUT array, custom-designed integrated circuits, a flip-chip bonding technique, and signal-processing hardware.
Açıklama
Anahtar Kelimeler
5 mm, Array signal processing, Arrays, Biomedical ultrasonics, Bonding, Bonding processes, Cables, Capacitative micromachined ultrasonic transducer (CMUT), Capacitive micromachined, Capacitive micromachined ultrasonic transducer, Capacitive micromachined ultrasonic transducer array, Capacitive sensors, CMUT, CMUT arrays, Custom-designed integrated circuit, Data acquisition, Electric potential, Electronic equipment, Endoscopic channel, Field programmable gate arrays, Flip-chip bonding, Flip-chip devices, FPGA-based signal-processing hardware, Front-end electronics, Hardware, Image processing equipment, Image reconstruction, Imaging probe, Integrated circuit design, Integrated circuit interconnections, Integrated ultrasonic imaging systems, Integrated circuits, Joining processes, Microsensors, Probes, Real-time three-dimensional imaging, Signal processing, Signal to noise ratio, Silicon nitride, Stanford Medical School, Systems integrated circuits, Three-dimensional, Three-dimensional systems, Through-wafer interconnects, Ultrasonic imaging, Ultrasonic transducer arrays, Ultrasonic transducers, Ultrasonic transducer
Kaynak
Proceedings - IEEE Ultrasonics Symposium
WoS Q Değeri
N/A
Scopus Q Değeri
N/A
Cilt
1
Sayı
Künye
Wygant, I. O., Zhuang, X., Yeh, D. T., Nikoozadeh, A., Oralkan, O., Ergün, A. S., . . . Khuri-Yakub, B. T. (2004). Integrated ultrasonic imaging systems based on CMUT arrays: Recent progress. Paper presented at the Proceedings - IEEE Ultrasonics Symposium, 1, 391-394. doi:10.1109/ULTSYM.2004.1417745
