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Yayın Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging(IEEE-INST Electrical Electronics Engineers Inc, 2008-02) Wygant, Ira O.; Zhuang, Xuefeng; Yeh, David T.; Oralkan, Ömer; Ergün, Arif Sanlı; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasFor three-dimensional (3D) ultrasound imaging, connecting elements of a two-dimensional (2D) transducer array to the imaging system's front-end electronics is a challenge because of the large number of array elements and the small element size. To compactly connect the transducer array with electronics, we flip-chip bond a 2D 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array to a custom-designed integrated circuit (IC). Through-wafer interconnects are used to connect the CMUT elements on the top side of the array with flip-chip bond pads on the back side. The IC provides a 25-V pulser and a transimpedance preamplifier to each element of the array. For each of three characterized devices, the element yield is excellent (99 to 100% of the elements are functional). Center frequencies range from 2.6 MHz to 5.1 MHz. For pulse-echo operation, the average -6-dB fractional bandwidth is as high as 125%. Transmit pressures normalized to the face of the transducer are as high as 339 kPa and input-referred receiver noise is typically 1.2 to 2.1 mPa/root Hz. The flip-chip bonded devices were used to acquire 3D synthetic aperture images of a wire-target phantom. Combining the transducer array and IC, as shown in this paper, allows for better utilization of large arrays, improves receive sensitivity, and may lead to new imaging techniques that depend on transducer arrays that are closely coupled to IC electronics.Yayın Damar içi öne bakan ultrasonik görüntüleme için eşdeğer dizi örnekleme yöntemleri(IEEE, 2009-06-26) Tekeş, Coşkun; Karaman, MustafaDamar içi öne bakan ultrasonik görüntüleme gerçek zamanlı hacimsel (üç boyutlu) görüntülemeye imkan vermesi bakımından yaygın olarak kullanılmaktadır. Damar içi görüntülemede fiziksel boyutların küçük olması nedeniyle alıcı-verici kanal sayısı çok sınırlanmakta ve dolayısıyla yapay evreli dizi teknikleri kullanılmaktadır. Öte yandan, harekete bağlı görüntü bozukluklarını azaltmak için işaret gönderme alma adım sayısının azaltılması gerekmektedir. Bu, eşdeğer dizideki fazlalık frekans bileşenleri azaltılarak sağlanabilir. Bu çalışmada, eşdeğer dizideki fazlalık frekans bileşenlerinin azaltılmasına dayalı farklı örnekleme teknikleri incelenmiştir. Bu tekniklerin görüntü kalitesi 64 elemanlı bir halkasal dizinin asıl ve kontrol eşdeğer dizileri referans alınarak karşılaştırmalı olarak irdelenmiştir. Benzetim sonuçları 64 elemanlı bir halka dizi için 2049 asıl küme, 350 azaltılmış küme 40 dB içinde eşdeğer performans vermektedir.Yayın Volumetric imaging using fan-beam scanning with reduced redundancy 2D arrays(IEEE, 2006) Wygant, Ira; Karaman, Mustafa; Oralkan, Ömer; Khuri-Yakub, Butrus ThomasPhased array processing with a fully populated 2D array produces the best image quality but requires excessive number of active parallel front-end channels. Here we explore four array designs with reduced redundancy in spatial frequency contents. To minimize the number of firings we employ fan-beam processing, where ID arrays are used to insonify 2D planar slices of the volume at successive firing events; echo signals are collected by the receive array elements. The array designs are compared based on simulated point spread functions, frame rate, motion susceptibility, and signal-to-noise ratio.Yayın Minimally redundant 2-D array designs for 3-D medical ultrasound imaging(IEEE-Inst Electrical Electronics Engineers Inc, 2009-07) Karaman, Mustafa; Wygant, Ira O.; Oralkan, Ömer; Khuri-Yakub, Butrus ThomasIn real-time ultrasonic 3-D imaging, in addition to difficulties in fabricating and interconnecting 2-D transducer arrays with hundreds of elements, there are also challenges in acquiring and processing data from a large number of ultrasound channels. The coarray (spatial convolution of the transmit and receive arrays) can be used to find efficient array designs that capture all of the spatial frequency content (a transmit-receive element combination corresponds to a spatial frequency) with a reduced number of active channels and firing events. Eliminating the redundancies in the transmit-receive element combinations and firing events reduces the overall system complexity and improves the frame rate. Here we explore four reduced redundancy 2-D array configurations for miniature 3-D ultrasonic imaging systems. Our approach is based on 1) coarray design with reduced redundancy using different subsets of linear arrays constituting the 2-D transducer array, and 2) 3-D scanning using fan-beams (narrow in one dimension and broad in the other dimension) generated by the transmit linear arrays. We form the overall array response through coherent summation of the individual responses of each transmit-receive array pairs. We present theoretical and simulated point spread functions of the array configurations along with quantitative comparison in terms of the front-end complexity and image quality.
