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Yayın Reviewing the effects of spatial features on price prediction for real estate market: Istanbul case(IEEE, 2022-09-16) Ecevit, Mert İlhan; Erdem, Zeki; Dağ, HasanIn the real estate market, spatial features play a crucial role in determining property appraisals and prices. When spatial features are considered, classification techniques have been rarely studied compared to regression, which is commonly used for price prediction. This study reviews spatial features' effects on predicting the house price ranges for real estate in Istanbul, Turkey, in the classification context. Spatial features are generated and extracted by geocoding the address information from the original data set. This geocoding and feature extraction is another challenge in this research. The experiments compare the performance of Decision Trees (DT), Random Forests (RF), and Logistic Regression (LR) classifier models on the data set with and without spatial features. The prediction models are evaluated based on classification metrics such as accuracy, precision, recall, and F1-Score. We additionally examine the ROC curve of each classifier. The test results show that the RF model outperforms the DT and LR models. It is observed that spatial features, when incorporated with non-spatial features, significantly improve the prediction performance of the models for the house price ranges. It is considered that the results can contribute to making decisions more accurately for the appraisal in the real estate industry.Yayın Design trade-offs and considerations for improving the PCB current carrying capacity in high power density power electronics applications(IEEE, 2022-03-24) Büyükdeğirmenci, Veysel Tutku; Kozarva, Ömer F.; Milletsever, Özgür C.; Hava, Ahmet MasumThis paper investigates printed circuit board (PCB) design trade-offs and considerations to maximize the current carrying capacity of traces in PCB-based power electronics applications. Many existing designs rely on methodologies through empirical data presented by the outdated IPC-2152 standard. A design methodology to maximize the utilized PCB area and improve thermal performance is introduced. To assess this methodology, lumped parameter (LP) and finite element (FE) models are developed and computational fluid dynamics (CFD) simulations are carried out. Thermal via placement strategies are investigated and maximum allowable power dissipation on the PCB traces is calculated. Simulations and analyses are experimentally validated on a PCB-based 100kW three-phase three-level inverter. The that results show that the thermal and electrical models discussed in this paper have superior accuracy compared to traditional formulations.Yayın Doğrudan pazarlama amaçlı hedef kitle analizi(Institute of Electrical and Electronics Engineers Inc., 2018-07-05) Kegeci, Sinan; Özbek, Eyüp Erkan; Türkel, Mustafa Sertaç; Düzağaç, Remzi; Yıldız, Olcay TanerDoğrudan pazarlama, uygun ürünleri uygun kişilerle en kısa yoldan buluşturma sürecidir. Son yılların en popüler pazarlama yaklaşımlarından birisidir. Bu çalışmada turizm sektörüne ait isimsizleştirilmiş bir veri tabanını kullandık. Bir otel zinciri için yapılan kampanya kapsamında veri madenciliği tekniklerini uygulayarak hedef kitle seçimi yaptık. Çalışmada birçok makine öğrenmesi yöntemini denedik. Sonuç olarak; geçmişte yapılan ve herhangi bir makine öğrenmesi yöntemi kullanılmadan hazırlanan kampanya sonuçlarına göre daha iyi sonuçlar elde ederken benzer analizlerde kullanılabilecek bir altyapı oluşturmuş olduk.












