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Yayın Spectral correlation of a digital pulse stream modulated by a cyclostationary sequence in the presence of timing jitter(IEEE-INST Electrical Electronics Engineers Inc, 2009-02) Öner, Mustafa MengüçCyclostationarity is an inherent characteristic of many communication signals, which can be exploited for performing various signal processing tasks. Imperfections in the signal generation that affect the cyclic statistics of a signal may lead to a degradation in the performance of signal processing algorithms which make use of this cyclostationary behaviour. One typical source of imperfection encountered in digital signalling techniques is random jitter in the pulse timing. In this work, we systematically derive analytical expressions for the cyclic statistics of digital baseband signalling schemes in the presence of timing jitter, under the assumption that the generating wide sense cyclostationary data sequence and the stationary jitter process are statistically independent.Yayın Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging(IEEE-INST Electrical Electronics Engineers Inc, 2008-02) Wygant, Ira O.; Zhuang, Xuefeng; Yeh, David T.; Oralkan, Ömer; Ergün, Arif Sanlı; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasFor three-dimensional (3D) ultrasound imaging, connecting elements of a two-dimensional (2D) transducer array to the imaging system's front-end electronics is a challenge because of the large number of array elements and the small element size. To compactly connect the transducer array with electronics, we flip-chip bond a 2D 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array to a custom-designed integrated circuit (IC). Through-wafer interconnects are used to connect the CMUT elements on the top side of the array with flip-chip bond pads on the back side. The IC provides a 25-V pulser and a transimpedance preamplifier to each element of the array. For each of three characterized devices, the element yield is excellent (99 to 100% of the elements are functional). Center frequencies range from 2.6 MHz to 5.1 MHz. For pulse-echo operation, the average -6-dB fractional bandwidth is as high as 125%. Transmit pressures normalized to the face of the transducer are as high as 339 kPa and input-referred receiver noise is typically 1.2 to 2.1 mPa/root Hz. The flip-chip bonded devices were used to acquire 3D synthetic aperture images of a wire-target phantom. Combining the transducer array and IC, as shown in this paper, allows for better utilization of large arrays, improves receive sensitivity, and may lead to new imaging techniques that depend on transducer arrays that are closely coupled to IC electronics.Yayın Range sensing with a Scheimpflug camera and a CMOS sensor/processor chip(IEEE-INST Electrical Electronics Engineers Inc, 2004-02) Çilingiroğlu, Uğur; Chen, Sicheng; Çilingiroğlu, EmreAn image-based range-sensing technique is presented. The technique is originally considered for highway collision avoidance applications, but its generality makes it suitable for application in robotics, manufacturing, and metrology, as well. It relies on depth from focus but, unlike conventional techniques, it extracts range with a single unmodulated Scheimpflug camera in continuous time. The range extraction algorithm is memoryless and simple enough to be implemented on the same chip with photosensors. The technique deploys a sensor plane that is tilted at a nonorthogonal angle with respect to the optical axis of the lens and the optical axis intersects the sensor plane at the focal point. This optical arrangement creates a focusable object plane in an orientation parallel to the optical axis and, thus, enables range sensing along the same axis. This paper elaborates on the details of focus sensing on the tilted sensor plane, describes the CMOS sensor/processor chip designed and prototyped for this application, and presents experimental results.
