Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays
Yükleniyor...
Dosyalar
Tarih
2005-12
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
IEEE-INST Electrical Electronics Engineers Inc
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Integration of front-end electronics with 2D capacitive micromachined ultrasonic transducer (CMUT) arrays has been a challenging issue due to the small element size and large channel count. We present design and verification of a front-end drive-readout integrated circuit for 3D ultrasonic imaging using 2D CMUT arrays. The circuit cell dedicated to a single CMUT array element consists of a high-voltage pulser and a low-noise readout amplifier. To analyze the circuit cell together with the CMUT element, we developed an electrical CMUT model with parameters derived through finite element analysis, and performed both the pre- and postlayout verification. An experimental chip consisting of 4 x 4 array of the designed circuit cells, each cell occupying a 200 x 200 mu m(2) area, was formed for the initial test studies and scheduled for fabrication in 0.8 mu m, 50 V CMOS technology. The designed circuit is suitable for integration with CMUT arrays through flip-chip bonding and the CMUT-on-CMOS process.
Açıklama
This work is supported by the Turkish Scientific and Technical Research Council (TUBITAK).
Anahtar Kelimeler
Ultrasonic transducers, Air, Acoustic arrays, Acoustic imaging, Circuit testing, Performance analysis, Pulse amplifiers, Pulse circuits, Ultrasonic imaging, Ultrasonic transducer arrays, Computer Simulation, Computer-aided design, Electric capacitance, Miniaturization, Semiconductors, Systems Integration, Transducers, Ultrasonography, 0.8 micron, 2D capacitive micromachined ultrasonic transducer arrays, 3D acoustic imaging, 50 V, CMOS technology, Finite element analysis, Flip-chip bonding, Front-end drive-readout integrated circuit design, High-voltage pulser, Low-noise readout amplifier, CMOS integrated circuits, Capacitive sensors, Integrated circuit design, Readout electronics
Kaynak
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
WoS Q Değeri
Q1
Scopus Q Değeri
Q1
Cilt
52
Sayı
12
Künye
Çicek, İ., Bozkurt, A. & Karaman, M. (2005). Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 52(12), 2235-2241. doi:10.1109/TUFFC.2005.1563266
