Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays

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dc.authorid0000-0002-9000-2805
dc.authorid0000-0003-4806-951X
dc.contributor.authorÇiçek, İhsanen_US
dc.contributor.authorBozkurt, Ayhanen_US
dc.contributor.authorKaraman, Mustafaen_US
dc.date.accessioned2015-01-15T23:00:19Z
dc.date.available2015-01-15T23:00:19Z
dc.date.issued2005-12
dc.departmentIşık Üniversitesi, Mühendislik Fakültesi, Elektrik-Elektronik Mühendisliği Bölümüen_US
dc.departmentIşık University, Faculty of Engineering, Department of Electrical-Electronics Engineeringen_US
dc.descriptionThis work is supported by the Turkish Scientific and Technical Research Council (TUBITAK).en_US
dc.description.abstractIntegration of front-end electronics with 2D capacitive micromachined ultrasonic transducer (CMUT) arrays has been a challenging issue due to the small element size and large channel count. We present design and verification of a front-end drive-readout integrated circuit for 3D ultrasonic imaging using 2D CMUT arrays. The circuit cell dedicated to a single CMUT array element consists of a high-voltage pulser and a low-noise readout amplifier. To analyze the circuit cell together with the CMUT element, we developed an electrical CMUT model with parameters derived through finite element analysis, and performed both the pre- and postlayout verification. An experimental chip consisting of 4 x 4 array of the designed circuit cells, each cell occupying a 200 x 200 mu m(2) area, was formed for the initial test studies and scheduled for fabrication in 0.8 mu m, 50 V CMOS technology. The designed circuit is suitable for integration with CMUT arrays through flip-chip bonding and the CMUT-on-CMOS process.en_US
dc.description.sponsorshipTürkiye Bilimsel ve Teknolojik Araştırma Kurumuen_US
dc.description.versionPublisher's Versionen_US
dc.identifier.citationÇicek, İ., Bozkurt, A. & Karaman, M. (2005). Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 52(12), 2235-2241. doi:10.1109/TUFFC.2005.1563266en_US
dc.identifier.doi10.1109/TUFFC.2005.1563266
dc.identifier.endpage2241
dc.identifier.issn0885-3010
dc.identifier.issn1525-8955
dc.identifier.issue12
dc.identifier.pmid16463489
dc.identifier.scopus2-s2.0-33644859258
dc.identifier.scopusqualityQ1
dc.identifier.startpage2235
dc.identifier.urihttps://hdl.handle.net/11729/166
dc.identifier.urihttp://dx.doi.org/10.1109/TUFFC.2005.1563266
dc.identifier.volume52
dc.identifier.wosWOS:000234398700008
dc.identifier.wosqualityQ1
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.indekslendigikaynakPubMeden_US
dc.indekslendigikaynakScience Citation Index Expanded (SCI-EXPANDED)en_US
dc.institutionauthorKaraman, Mustafaen_US
dc.language.isoenen_US
dc.peerreviewedYesen_US
dc.publicationstatusPublisheden_US
dc.publisherIEEE-INST Electrical Electronics Engineers Incen_US
dc.relation.ispartofIEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Controlen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectUltrasonic transducersen_US
dc.subjectAiren_US
dc.subjectAcoustic arraysen_US
dc.subjectAcoustic imagingen_US
dc.subjectCircuit testingen_US
dc.subjectPerformance analysisen_US
dc.subjectPulse amplifiersen_US
dc.subjectPulse circuitsen_US
dc.subjectUltrasonic imagingen_US
dc.subjectUltrasonic transducer arraysen_US
dc.subjectComputer Simulationen_US
dc.subjectComputer-aided designen_US
dc.subjectElectric capacitanceen_US
dc.subjectMiniaturizationen_US
dc.subjectSemiconductorsen_US
dc.subjectSystems Integrationen_US
dc.subjectTransducersen_US
dc.subjectUltrasonographyen_US
dc.subject0.8 micronen_US
dc.subject2D capacitive micromachined ultrasonic transducer arraysen_US
dc.subject3D acoustic imagingen_US
dc.subject50 Ven_US
dc.subjectCMOS technologyen_US
dc.subjectFinite element analysisen_US
dc.subjectFlip-chip bondingen_US
dc.subjectFront-end drive-readout integrated circuit designen_US
dc.subjectHigh-voltage pulseren_US
dc.subjectLow-noise readout amplifieren_US
dc.subjectCMOS integrated circuitsen_US
dc.subjectCapacitive sensorsen_US
dc.subjectIntegrated circuit designen_US
dc.subjectReadout electronicsen_US
dc.titleDesign of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arraysen_US
dc.typeArticleen_US
dspace.entity.typePublication

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