An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging

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Tarih

2009-10

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Dergi ISSN

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Yayıncı

IEEE-INST Electrical Electronics Engineers Inc

Erişim Hakkı

info:eu-repo/semantics/closedAccess

Araştırma projeleri

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Dergi sayısı

Özet

State-of-the-art 3-D medical ultrasound imaging requires transmitting and receiving ultrasound using a 2-D array of ultrasound transducers with hundreds or thousands of elements. A tight combination of the transducer array with integrated circuitry eliminates bulky cables connecting the elements of the transducer array to a separate system of electronics. Furthermore, preamplifiers located close to the array can lead to improved receive sensitivity. A combined IC and transducer array can lead to a portable, high-performance, and inexpensive 3-D ultrasound imaging system. This paper presents an IC flip-chip bonded to a 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array for 3-D ultrasound imaging. The IC includes a transmit beamformer that generates 25-V unipolar pulses with programmable focusing delays to 224 of the 256 transducer elements. One-shot circuits allow adjustment of the pulse widths for different ultrasound transducer center frequencies. For receiving reflected ultrasound signals, the IC uses the 32-elements along the array diagonals. The IC provides each receiving element with a low-noise 25-MHz-bandwidth transimpedance amplifier. Using a field-programmable gate array (FPGA) clocked at 100 MHz to operate the IC, the IC generated property timed transmit pulses with 5-ns accuracy. With the IC flip-chip bonded to a CMUT array, we show that the IC can produce steered and focused ultrasound beams. We present 2-D and 3-D images of a wire phantom and 2-D orthogonal cross-sectional images (B-scans) of a latex heart phantom.

Açıklama

Anahtar Kelimeler

Real-time, Medical ultrasound, Transducers, System, Echocardiography, Interconnect, Architecture, Technology, Efficiency, Fetus

Kaynak

IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control

WoS Q Değeri

Q1

Scopus Q Değeri

Q1

Cilt

56

Sayı

10

Künye

Wygant, I., Jamal, N., Lee, H. J.., . . .& Khuri-yakub, B. T. (2009). An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 56(10), 2145-2156. doi:10.1109/TUFFC.2009.1297