An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging

Basit Öğe Kaydı
dc.authorid0000-0001-8616-6877
dc.authorid0000-0003-3940-7898
dc.contributor.authorWygant, Ira O.en_US
dc.contributor.authorJamal, Nafis S.en_US
dc.contributor.authorLee, Hyunjoo J.en_US
dc.contributor.authorNikoozadeh, Aminen_US
dc.contributor.authorOralkan, Ömeren_US
dc.contributor.authorKaraman, Mustafaen_US
dc.contributor.authorKhuri-Yakub, Butrus Thomasen_US
dc.date.accessioned2015-01-15T23:01:18Z
dc.date.available2015-01-15T23:01:18Z
dc.date.issued2009-10
dc.departmentIşık Üniversitesi, Mühendislik Fakültesi, Elektrik-Elektronik Mühendisliği Bölümüen_US
dc.departmentIşık University, Faculty of Engineering, Department of Electrical-Electronics Engineeringen_US
dc.description.abstractState-of-the-art 3-D medical ultrasound imaging requires transmitting and receiving ultrasound using a 2-D array of ultrasound transducers with hundreds or thousands of elements. A tight combination of the transducer array with integrated circuitry eliminates bulky cables connecting the elements of the transducer array to a separate system of electronics. Furthermore, preamplifiers located close to the array can lead to improved receive sensitivity. A combined IC and transducer array can lead to a portable, high-performance, and inexpensive 3-D ultrasound imaging system. This paper presents an IC flip-chip bonded to a 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array for 3-D ultrasound imaging. The IC includes a transmit beamformer that generates 25-V unipolar pulses with programmable focusing delays to 224 of the 256 transducer elements. One-shot circuits allow adjustment of the pulse widths for different ultrasound transducer center frequencies. For receiving reflected ultrasound signals, the IC uses the 32-elements along the array diagonals. The IC provides each receiving element with a low-noise 25-MHz-bandwidth transimpedance amplifier. Using a field-programmable gate array (FPGA) clocked at 100 MHz to operate the IC, the IC generated property timed transmit pulses with 5-ns accuracy. With the IC flip-chip bonded to a CMUT array, we show that the IC can produce steered and focused ultrasound beams. We present 2-D and 3-D images of a wire phantom and 2-D orthogonal cross-sectional images (B-scans) of a latex heart phantom.en_US
dc.description.sponsorshipThis work was supported by NIH grant CA99059. Work was performed in part at the Stanford Nanofabrication Facility (a member of the National Nanotechnology Infrastructure, Network) which is supported by the National Science Foundation under Grant ECS-9731293.en_US
dc.description.versionPublisher's Versionen_US
dc.identifier.citationWygant, I., Jamal, N., Lee, H. J.., . . .& Khuri-yakub, B. T. (2009). An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 56(10), 2145-2156. doi:10.1109/TUFFC.2009.1297en_US
dc.identifier.doi10.1109/TUFFC.2009.1297
dc.identifier.endpage2156
dc.identifier.issn0885-3010
dc.identifier.issn1525-8955
dc.identifier.issue10
dc.identifier.pmid19942502
dc.identifier.scopus2-s2.0-72749107528
dc.identifier.scopusqualityQ1
dc.identifier.startpage2145
dc.identifier.urihttps://hdl.handle.net/11729/319
dc.identifier.urihttp://dx.doi.org/10.1109/TUFFC.2009.1297
dc.identifier.volume56
dc.identifier.wosWOS:000270592000011
dc.identifier.wosqualityQ1
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.indekslendigikaynakPubMeden_US
dc.indekslendigikaynakScience Citation Index Expanded (SCI-EXPANDED)en_US
dc.institutionauthorKaraman, Mustafaen_US
dc.language.isoenen_US
dc.peerreviewedYesen_US
dc.publicationstatusPublisheden_US
dc.publisherIEEE-INST Electrical Electronics Engineers Incen_US
dc.relation.ispartofIEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Controlen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectReal-timeen_US
dc.subjectMedical ultrasounden_US
dc.subjectTransducersen_US
dc.subjectSystemen_US
dc.subjectEchocardiographyen_US
dc.subjectInterconnecten_US
dc.subjectArchitectureen_US
dc.subjectTechnologyen_US
dc.subjectEfficiencyen_US
dc.subjectFetusen_US
dc.titleAn integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imagingen_US
dc.typeArticleen_US
dspace.entity.typePublication

Dosyalar

Orijinal paket
Listeleniyor 1 - 1 / 1
Küçük Resim Yok
İsim:
319.pdf
Boyut:
1.36 MB
Biçim:
Adobe Portable Document Format
Açıklama:
Publisher's Version
İndir

Koleksiyon

Makale Koleksiyonu | Elektrik-Elektronik Mühendisliği Bölümü
PubMed İndeksli Yayın Koleksiyonu
Scopus İndeksli Yayınlar Koleksiyonu
WoS İndeksli Yayınlar Koleksiyonu