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Yayın Volumetric ultrasound imaging using 2-D CMUT arrays(IEEE-Inst Electrical Electronics Engineers Inc, 2003-11) Oralkan, Ömer; Ergün, Arif Sanlı; Cheng, Ching-Hsiang; Johnson, Jeremy A.; Karaman, Mustafa; H. Lee, Thomas; Khuri-Yakub, Butrus ThomasRecently, capacitive micromachined ultrasonic transducers (CMUTs) have emerged as a candidate to overcome the difficulties in the realization of 2-D arrays for real-time 3-D imaging. In this paper, we present the first volumetric images obtained using a 2-D CMUT array. We have fabricated a 128 x 128-element 2-D CMUT array with through-wafer via interconnects and a 420-mum element pitch. As an experimental prototype, a 32 x 64-element portion of the 128 X 128-element array was diced and flip-chip bonded onto a glass fanout chip. This chip provides individual leads from a central 16 X 16-element portion of the array to surrounding bondpads. An 8 x 16-element poition of the array was used in the experiments along with a 128-channel data acquisition system. For imaging phantoms, we used a 2.37-mm diameter steel sphere located 10 mm from the array center and two 12-mm-thick Plexiglas plates located 20 mm and 60 mm from the array. A 4 X 4 group of elements in the middle of the 8 X 16-element array was used in transmit, and the remaining elements were used to receive the echo signals. The echo signal obtained from the spherical target presented a frequency spectrum centered at 4.37 MHz with a 100% fractional bandwidth, whereas the frequency spectrum for the echo signal from the parallel plate phantom was centered at 3.44 MHz with a 91% fractional bandwidth. The images were reconstructed by using RF beamforming and synthetic phased array approaches and visualized by surface rendering and multiplanar slicing techniques. The image of the spherical target has been used to approximate the point spread function of the system and is compared with theoretical expectations. This study experimentally demonstrates that 2-D CMUT arrays can be fabricated with high yield using silicon IC-fabrication processes, individual electrical connections can be provided using through-wafer vias, and flip-chip bonding can be used to integrate these dense 2-D arrays with electronic circuits for practical 3-D imaging applications.Yayın Video çerçeve hız artırımında kapatma yapaylıklarının giderilmesi(IEEE, 2009-06-26) Çizmeci, Burak; Ateş, Hasan FehmiÇerçeve hız arttırımı (ÇHA) yöntemleri, önceleri video standartları arası dönüşümlerde kullanılmış günümüzde ise büyük ekran LCD ve plazma Tv setlerinde daha kaliteli görüntü için sayısal video yayınının zamansal çözünürlüğünün arttırılmasında uygulanmaya başlanmıştır. DSP, FPGA ve ASIC gibi donanımların işlem gücünün artması ÇHA probleminin çözümünde yüksek karmaşıklıkta algoritmaların tasarlanmasına olanak sağlamıştır.Bu bildiride çok aşamalı devinim vektör (DV) iyileştirilmesi art işlemleri ve kapanma/açılma bölgelerine uyarlamalı örtüşmeli blok devinim denkleştirmesi yöntemleri ile uzamsal ve zamansal düzlemde tutarlı bir ÇHA algoritması önermekteyiz. Hekzagonal devinim kestirim (DK) algoritmasının verdiği düşük güvenirlikli DV'leri çok aşamalı iyileştirme art-işlemlerine tabi tutulur. Uzamsal olarak tutarlı bir DV alanı elde edildikten sonra komşu vektörler arasındaki ilişkiler ve ardışık 4 çerçevenin DV bilgisi kullanılarak kapanma/açılma bölgeleri tespit edilir.Örtüşmeli blok devinim denkleştirme filtresi (ÖBDD) tespit edilen bu bölgelelere uyarlanarak kapanma/açılmadan kaynaklanan yapaylıkların azaltılması sağlanır. Böylece var olan ÇHA yöntemlerine göre uzamsal çözünürlükten daha az ödün verilerek ve daha az yapaylıkla ÇHA gerçekleştirilmektedir.Yayın Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging(IEEE-INST Electrical Electronics Engineers Inc, 2008-02) Wygant, Ira O.; Zhuang, Xuefeng; Yeh, David T.; Oralkan, Ömer; Ergün, Arif Sanlı; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasFor three-dimensional (3D) ultrasound imaging, connecting elements of a two-dimensional (2D) transducer array to the imaging system's front-end electronics is a challenge because of the large number of array elements and the small element size. To compactly connect the transducer array with electronics, we flip-chip bond a 2D 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array to a custom-designed integrated circuit (IC). Through-wafer interconnects are used to connect the CMUT elements on the top side of the array with flip-chip bond pads on the back side. The IC provides a 25-V pulser and a transimpedance preamplifier to each element of the array. For each of three characterized devices, the element yield is excellent (99 to 100% of the elements are functional). Center frequencies range from 2.6 MHz to 5.1 MHz. For pulse-echo operation, the average -6-dB fractional bandwidth is as high as 125%. Transmit pressures normalized to the face of the transducer are as high as 339 kPa and input-referred receiver noise is typically 1.2 to 2.1 mPa/root Hz. The flip-chip bonded devices were used to acquire 3D synthetic aperture images of a wire-target phantom. Combining the transducer array and IC, as shown in this paper, allows for better utilization of large arrays, improves receive sensitivity, and may lead to new imaging techniques that depend on transducer arrays that are closely coupled to IC electronics.Yayın Monolithic CMUT-on-CMOS integration for intravascular ultrasound applications(IEEE-INST Electrical Electronics Engineers Inc, 2011-12) Zahorian, Jaime S.; Hochman, Michael; Xu, Toby; Satır, Sarp; Gürün, Gökçe; Karaman, Mustafa; Değertekin, Fahrettin LeventOne of the most important promises of capacitive micromachined ultrasonic transducer (CMUT) technology is integration with electronics. This approach is required to minimize the parasitic capacitances in the receive mode, especially in catheter-based volumetric imaging arrays, for which the elements must be small. Furthermore, optimization of the available silicon area and minimized number of connections occurs when the CMUTs are fabricated directly above the associated electronics. Here, we describe successful fabrication and performance evaluation of CMUT arrays for intravascular imaging on custom-designed CMOS receiver electronics from a commercial IC foundry. The CMUT-on-CMOS process starts with surface isolation and mechanical planarization of the CMOS electronics to reduce topography. The rest of the CMUT fabrication is achieved by modifying a low-temperature micromachining process through the addition of a single mask and developing a dry etching step to produce sloped sidewalls for simple and reliable CMUT-to-CMOS interconnection. This CMUT-to-CMOS interconnect method reduced the parasitic capacitance by a factor of 200 when compared with a standard wire-bonding method. Characterization experiments indicate that the CMUT-on-CMOS elements are uniform in frequency response and are similar to CMUTs simultaneously fabricated on standard silicon wafers without electronics integration. Experiments on a 1.6-mm-diameter dual-ring CMUT array with a center frequency of 15 MHz show that both the CMUTs and the integrated CMOS electronics are fully functional. The SNR measurements indicate that the performance is adequate for imaging chronic total occlusions located 1 cm from the CMUT array.Yayın Optimisation of pedestrian detection system using FPGA-CPU hybrid implementation for vehicle industry(Inderscience Enterprises Ltd., 2019) Özcan, Ahmet Remzi; Tavşanoǧlu, Ahmet VedatImproved image processing and developing technologies are rapidly expanding the application areas of image processing systems. In recent years, pedestrian detection systems have become one of the major safety technologies used in the automotive industry. This paper presents an optimised real-time pedestrian detection system using an FPGA-CPU based hybrid design. The histograms of oriented gradients (HOG) algorithm, which is extensively used for feature extraction in pedestrian detection applications, was implemented on a low-end FPGA. In the study, the original HOG descriptors are designed in low complexity without sacrificing performance. The obtained features were classified on a low-power single board computer with support vector machine (SVM). Tests with the INRIA pedestrian database show that the proposed model has high potential for use as a real-time low-cost pedestrian detection system in practice.Yayın Derin öznitelikler ile anlambilimsel görüntü bölütleme(Institute of Electrical and Electronics Engineers Inc., 2018-07-05) Sünetci, Sercan; Ateş, Hasan FehmiDerin evrişimsel sinir ağları (ESA) pek çok sınıflandırma probleminde olduğu gibi anlambilimsel görüntü bölütlemede de çok ciddi başarı göstermiştir. Fakat derin ağların eğitilmesi hem zaman alıcıdır hem de geniş bir eğitim veri kümesine ihtiyaç duymaktadır. Bir veri kümesinde eğitilen ağın başka bir görev ya da veri kümesine uygulanabilmesi için transfer öğrenme ile yeniden eğitilmesi gerekmektedir. Transfer öğrenmeye alternatif olarak ağ katmanlarından çıkarılan öznitelik vektörleri doğrudan sınıflandırma amaçlı kullanılabilir. Bu bildiride genel ESA mimarilerinden elde edilen özniteliklerin eğitim gerektirmeyen bir görüntü etiketleme yönteminde kullanılmasının sınıflandırma başarımına katkısı incelenmiştir. Derin ağlarda ‘öğrenilmiş’ öznitelikler ile SIFT gibi ‘el yapımı’ özniteliklerin birlikte kullanılmasının etiketleme doğruluğunu artırdığı gösterilmiştir. Varolan ön eğitimli ağların kullanılması sayesinde önerilen yaklaşım herhangi bir veri kümesinde yeniden eğitime gerek olmadan kolayca uygulanabilmektedir. Önerilen yöntem iki veri kümesinde test edilmiş ve etiketleme doğruluğu benzer yöntemlerle karşılaştırmalı olarak sunulmuştur.Yayın Coherent array imaging using phased subarrays. Part II: Simulations and experimental results(IEEE-INST Electrical Electronics Engineers Inc, 2005-01) Johnson, Jeremy A.; Oralkan, Ömer; Ergün, Arif Sanlı; Demirci, Utkan; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasThe basic principles and theory of phased subarray (PSA) imaging imaging provides the flexibility of reducing I he number of front-end hardware channels between that of classical synthetic aperture (CSA) imaging-which uses only one element per firing event-and full-phased array (FPA,) imaging-which uses all elements for each firing. The performance of PSA generally ranges between that obtained by CSA and FPA using the same array, and depends on the amount of hardware complexity reduction. For the work described in this paper, we performed FPA, CSA, and PSA imaging of a resolution phantom using both simulated and experimental data from a 3-MHz, 3.2-cm, 128-element capacitive micromachined ultrasound transducer (CMUT) array. The simulated system point responses in the spatial and frequency domains are presented as a means of studying the effects of signal bandwidth, reconstruction filter size, and subsampling rate on the PSA system performance. The PSA and FPA sector-scanned images were reconstructed using the wideband experimental data with 80% fractional bandwidth, with seven 32-element subarrays used for PSA imaging. The measurements on the experimental sector images indicate that, at the transmit focal zone, the PSA method provides a 10% improvement in the 6-dB lateral resolution, and the axial point resolution of PSA imaging is identical to that of FPA imaging. The signal-to-noise ratio (SNR) of PSA image was 58.3 dB, 4.9 dB below that of the FPA image, and the contrast-to-noise ratio (CNR) is reduced by 10%. The simulated and experimental test results presented in this paper validate theoretical expectations and illustrate the flexibility of PSA imaging as a way to exchange SNR and frame rate for simplified front-end hardware.Yayın Adaptive convolution kernel for artificial neural networks(Academic Press Inc., 2021-02) Tek, Faik Boray; Çam, İlker; Karlı, DenizMany deep neural networks are built by using stacked convolutional layers of fixed and single size (often 3 × 3) kernels. This paper describes a method for learning the size of convolutional kernels to provide varying size kernels in a single layer. The method utilizes a differentiable, and therefore backpropagation-trainable Gaussian envelope which can grow or shrink in a base grid. Our experiments compared the proposed adaptive layers to ordinary convolution layers in a simple two-layer network, a deeper residual network, and a U-Net architecture. The results in the popular image classification datasets such as MNIST, MNIST-CLUTTERED, CIFAR-10, Fashion, and ‘‘Faces in the Wild’’ showed that the adaptive kernels can provide statistically significant improvements on ordinary convolution kernels. A segmentation experiment in the Oxford-Pets dataset demonstrated that replacing ordinary convolution layers in a U-shaped network with 7 × 7 adaptive layers can improve its learning performance and ability to generalize.Yayın Annular-ring CMUT arrays for forward-looking IVUS: Transducer characterization and imaging(IEEE, 2006-02) Değertekin, Fahrettin Levent; Güldiken, Rasim Oytun; Karaman, MustafaIn this study, a 64-element, 1.15-mm diameter annular-ring capacitive micromachined ultrasonic transducer (CMUT) array was characterized and used for forward-looking intravascular ultrasound (IVUS) imaging tests. The array was manufactured using low-temperature processes suitable for CMOS electronics integration oil a single chip. The measured radiation pattern of a 43 X 140- mu m(2) array element depicts a 40 degrees view angle for forward-looking imaging around a 15-MHz center frequency in agreement with theoretical models. Pulse-echo measurements show a -10-dB fractional bandwidth of 104% around 17 MHz for wire targets 2.5 mm away from the array in vegetable oil. For imaging and SNR measurements, RF A-scan data sets from various targets were collected using all interconnect scheme forming a 32-element array configuration. An experimental point spread function was obtained and compared with simulated and theoretical array responses, showing good agreement. Therefore, this study demonstrates that annular-ring CMUT arrays fabricated with CMOS-compatible processes are capable of forward-looking IVUS imaging, and the developed modeling tools can be used to design improved IVUS imaging arrays.Yayın Analysis of single image super resolution models(IEEE, 2022-11-18) Köprülü, Mertali; Eskil, Mustafa TanerImage Super-Resolution (SR) is a set of image processing techniques which improve the resolution of images and videos. Deep learning approaches have made remarkable improvement in image super-resolution in recent years. This article aims and seeks to provide a comprehensive analysis on recent advances of models which has been used in image superresolution. This study has been investigated over other essential topics of current model problems, such as publicly accessible benchmark data-sets and performance evaluation measures. Finally, The study concluded these analysis by highlighting several weaknesses of existing base models as their feeding strategy and approved that the training technique which is Blind Feeding, which led several model to achieve state-of-the art.
