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Yayın Volumetric ultrasound imaging using 2-D CMUT arrays(IEEE-Inst Electrical Electronics Engineers Inc, 2003-11) Oralkan, Ömer; Ergün, Arif Sanlı; Cheng, Ching-Hsiang; Johnson, Jeremy A.; Karaman, Mustafa; H. Lee, Thomas; Khuri-Yakub, Butrus ThomasRecently, capacitive micromachined ultrasonic transducers (CMUTs) have emerged as a candidate to overcome the difficulties in the realization of 2-D arrays for real-time 3-D imaging. In this paper, we present the first volumetric images obtained using a 2-D CMUT array. We have fabricated a 128 x 128-element 2-D CMUT array with through-wafer via interconnects and a 420-mum element pitch. As an experimental prototype, a 32 x 64-element portion of the 128 X 128-element array was diced and flip-chip bonded onto a glass fanout chip. This chip provides individual leads from a central 16 X 16-element portion of the array to surrounding bondpads. An 8 x 16-element poition of the array was used in the experiments along with a 128-channel data acquisition system. For imaging phantoms, we used a 2.37-mm diameter steel sphere located 10 mm from the array center and two 12-mm-thick Plexiglas plates located 20 mm and 60 mm from the array. A 4 X 4 group of elements in the middle of the 8 X 16-element array was used in transmit, and the remaining elements were used to receive the echo signals. The echo signal obtained from the spherical target presented a frequency spectrum centered at 4.37 MHz with a 100% fractional bandwidth, whereas the frequency spectrum for the echo signal from the parallel plate phantom was centered at 3.44 MHz with a 91% fractional bandwidth. The images were reconstructed by using RF beamforming and synthetic phased array approaches and visualized by surface rendering and multiplanar slicing techniques. The image of the spherical target has been used to approximate the point spread function of the system and is compared with theoretical expectations. This study experimentally demonstrates that 2-D CMUT arrays can be fabricated with high yield using silicon IC-fabrication processes, individual electrical connections can be provided using through-wafer vias, and flip-chip bonding can be used to integrate these dense 2-D arrays with electronic circuits for practical 3-D imaging applications.Yayın Spherical coding algorithm for wavelet image compression(IEEE-Inst Electrical Electronics Engineers Inc, 2009-05) Ateş, Hasan Fehmi; Orchard, Michael T.In recent literature, there exist many high-performance wavelet coders that use different spatially adaptive coding techniques in order to exploit the spatial energy compaction property of the wavelet transform. Two crucial issues in adaptive methods are the level of flexibility and the coding efficiency achieved while modeling different image regions and allocating bitrate within the wavelet subbands. In this paper, we introduce the "spherical coder," which provides a new adaptive framework for handling these issues in a simple and effective manner. The coder uses local energy as a direct measure to differentiate between parts of the wavelet subband and to decide how to allocate the available bitrate. As local energy becomes available at finer resolutions, i.e., in smaller size windows, the coder automatically updates its decisions about how to spend the bitrate. We use a hierarchical set of variables to specify and code the local energy up to the highest resolution, i.e., the energy of individual wavelet coefficients. The overall scheme is nonredundant, meaning that the subband information is conveyed using this equivalent set of variables without the need for any side parameters. Despite its simplicity, the algorithm produces PSNR results that are competitive with the state-of-art coders in literature.Yayın An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging(IEEE-INST Electrical Electronics Engineers Inc, 2009-10) Wygant, Ira O.; Jamal, Nafis S.; Lee, Hyunjoo J.; Nikoozadeh, Amin; Oralkan, Ömer; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasState-of-the-art 3-D medical ultrasound imaging requires transmitting and receiving ultrasound using a 2-D array of ultrasound transducers with hundreds or thousands of elements. A tight combination of the transducer array with integrated circuitry eliminates bulky cables connecting the elements of the transducer array to a separate system of electronics. Furthermore, preamplifiers located close to the array can lead to improved receive sensitivity. A combined IC and transducer array can lead to a portable, high-performance, and inexpensive 3-D ultrasound imaging system. This paper presents an IC flip-chip bonded to a 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array for 3-D ultrasound imaging. The IC includes a transmit beamformer that generates 25-V unipolar pulses with programmable focusing delays to 224 of the 256 transducer elements. One-shot circuits allow adjustment of the pulse widths for different ultrasound transducer center frequencies. For receiving reflected ultrasound signals, the IC uses the 32-elements along the array diagonals. The IC provides each receiving element with a low-noise 25-MHz-bandwidth transimpedance amplifier. Using a field-programmable gate array (FPGA) clocked at 100 MHz to operate the IC, the IC generated property timed transmit pulses with 5-ns accuracy. With the IC flip-chip bonded to a CMUT array, we show that the IC can produce steered and focused ultrasound beams. We present 2-D and 3-D images of a wire phantom and 2-D orthogonal cross-sectional images (B-scans) of a latex heart phantom.Yayın Optimizing circular ring arrays for forward-looking IVUS imaging(IEEE-Inst Electrical Electronics Engineers Inc, 2011-12) Tekeş, Coşkun; Karaman, Mustafa; Değertekin, Fahrettin LeventForward-looking (FL) catheter-based imaging systems are highly desirable for guiding interventions in intravascular ultrasound (IVUS) applications. One of the main challenges of array-based FL-IVUS systems is the large channel count, which results in increased system complexity. Synthetic phased-array processing with a reduced firing count simplifies the front-end and, hence, can enable 3-D real-time imaging. Recently, we have investigated dual-ring arrays suitable for IVUS imaging, in which the two concentric circular arrays are used separately as transmit (Tx) and receive (Rx) arrays. In this study, we present different optimized array designs based on dual and single circular rings which are suitable for synthetic phased-array processing with a reduced number of firings. To obtain an optimal firing set that produces low side lobes in the wideband response, we use a simulated annealing algorithm. In the simulations, we use 1.2-mm-diameter array configurations with 64 Tx and 58 Rx elements, a center frequency of 20 MHz and fractional bandwidths of 50% and 80%. The results show that optimized dual-ring arrays provide 8 dB improvements in peak near side-lobe level with no widening in the main lobe width when compared with full and other sparse co-arrays.Yayın Channel modelling for indoor visible light communications(Royal Society Publishing, 2020-04-17) Miramirkhani, Farshad; Uysal, MuratVisible light communication (VLC) allows the dual use of light-emitting diodes (LEDs) for wireless communication purposes in addition to their primary purpose of illumination. As in any other communication system, realistic channel modelling is a key for VLC system design, analysis and testing. In this paper, we present a comprehensive survey of indoor VLC channel models. In order to set the background, we start with an overview of infrared (IR) channel modelling, which has received much attention in the past, and highlight the differences between visible and IR optical bands. In the light of these, we present a comparative discussion of existing VLC channel modelling studies and point out the relevant advantages and disadvantages. Then, we provide a detailed description of a site-specific channel modelling approach based on non-sequential ray tracing that precisely captures the optical propagation characteristics of a given indoor environment. We further present channel models for representative deployment scenarios developed through this approach that were adopted by the Institute of Electrical and Electronics Engineering (IEEE) as reference channel models. Finally, we consider mobile VLC scenarios and investigate the effect of receiver location and rotation for a mobile indoor user. This article is part of the theme issue ‘Optical wireless communication’.Yayın Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays(IEEE-INST Electrical Electronics Engineers Inc, 2005-12) Çiçek, İhsan; Bozkurt, Ayhan; Karaman, MustafaIntegration of front-end electronics with 2D capacitive micromachined ultrasonic transducer (CMUT) arrays has been a challenging issue due to the small element size and large channel count. We present design and verification of a front-end drive-readout integrated circuit for 3D ultrasonic imaging using 2D CMUT arrays. The circuit cell dedicated to a single CMUT array element consists of a high-voltage pulser and a low-noise readout amplifier. To analyze the circuit cell together with the CMUT element, we developed an electrical CMUT model with parameters derived through finite element analysis, and performed both the pre- and postlayout verification. An experimental chip consisting of 4 x 4 array of the designed circuit cells, each cell occupying a 200 x 200 mu m(2) area, was formed for the initial test studies and scheduled for fabrication in 0.8 mu m, 50 V CMOS technology. The designed circuit is suitable for integration with CMUT arrays through flip-chip bonding and the CMUT-on-CMOS process.Yayın Forward-viewing CMUT arrays for medical Imaging(IEEE-INST Electrical Electronics Engineers Inc, 2004-07) Demirci, Utkan; Ergün, Arif Sanlı; Oralkan, Ömer; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasThis paper reports the design and testing of forward-viewing annular arrays fabricated using capacitive micromachined ultrasonic transducer (CMUT) technology. Recent research studies have shown that CMUTs have broad frequency bandwidth and high-transduction efficiency. One- and two-dimensional CMUT arrays of various sizes already have been fabricated, and their viability for medical imaging applications has been demonstrated. We fabricated 64-element, forward-viewing annular arrays using the standard CMUT fabrication process and carried out experiments to measure the operating frequency, bandwidth, and transmit/receive efficiency of the array elements. The annular array elements, designed for imaging applications in the 20 MHz range, had a resonance frequency of 13.5 MHz in air. The immersion pulse-echo data collected from a plane reflector showed that the devices operate in the 5-26 MHz range with a fractional bandwidth of 135%. The output pressure at the surface of the transducer was measured to be 24 kPa/V. These values translate into a dynamic range of 131.5 dB for I-V excitation in 1-Hz bandwidth with a commercial low noise receiving circuitry. The designed, forward-viewing annular CMUT array is suitable for mounting on the front surface of a cylindrical catheter probe and can provide Doppler information for measurement of blood flow and guiding information for navigation through blood vessels in intravascular ultrasound imaging.Yayın Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging(IEEE-INST Electrical Electronics Engineers Inc, 2008-02) Wygant, Ira O.; Zhuang, Xuefeng; Yeh, David T.; Oralkan, Ömer; Ergün, Arif Sanlı; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasFor three-dimensional (3D) ultrasound imaging, connecting elements of a two-dimensional (2D) transducer array to the imaging system's front-end electronics is a challenge because of the large number of array elements and the small element size. To compactly connect the transducer array with electronics, we flip-chip bond a 2D 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array to a custom-designed integrated circuit (IC). Through-wafer interconnects are used to connect the CMUT elements on the top side of the array with flip-chip bond pads on the back side. The IC provides a 25-V pulser and a transimpedance preamplifier to each element of the array. For each of three characterized devices, the element yield is excellent (99 to 100% of the elements are functional). Center frequencies range from 2.6 MHz to 5.1 MHz. For pulse-echo operation, the average -6-dB fractional bandwidth is as high as 125%. Transmit pressures normalized to the face of the transducer are as high as 339 kPa and input-referred receiver noise is typically 1.2 to 2.1 mPa/root Hz. The flip-chip bonded devices were used to acquire 3D synthetic aperture images of a wire-target phantom. Combining the transducer array and IC, as shown in this paper, allows for better utilization of large arrays, improves receive sensitivity, and may lead to new imaging techniques that depend on transducer arrays that are closely coupled to IC electronics.Yayın Monolithic CMUT-on-CMOS integration for intravascular ultrasound applications(IEEE-INST Electrical Electronics Engineers Inc, 2011-12) Zahorian, Jaime S.; Hochman, Michael; Xu, Toby; Satır, Sarp; Gürün, Gökçe; Karaman, Mustafa; Değertekin, Fahrettin LeventOne of the most important promises of capacitive micromachined ultrasonic transducer (CMUT) technology is integration with electronics. This approach is required to minimize the parasitic capacitances in the receive mode, especially in catheter-based volumetric imaging arrays, for which the elements must be small. Furthermore, optimization of the available silicon area and minimized number of connections occurs when the CMUTs are fabricated directly above the associated electronics. Here, we describe successful fabrication and performance evaluation of CMUT arrays for intravascular imaging on custom-designed CMOS receiver electronics from a commercial IC foundry. The CMUT-on-CMOS process starts with surface isolation and mechanical planarization of the CMOS electronics to reduce topography. The rest of the CMUT fabrication is achieved by modifying a low-temperature micromachining process through the addition of a single mask and developing a dry etching step to produce sloped sidewalls for simple and reliable CMUT-to-CMOS interconnection. This CMUT-to-CMOS interconnect method reduced the parasitic capacitance by a factor of 200 when compared with a standard wire-bonding method. Characterization experiments indicate that the CMUT-on-CMOS elements are uniform in frequency response and are similar to CMUTs simultaneously fabricated on standard silicon wafers without electronics integration. Experiments on a 1.6-mm-diameter dual-ring CMUT array with a center frequency of 15 MHz show that both the CMUTs and the integrated CMOS electronics are fully functional. The SNR measurements indicate that the performance is adequate for imaging chronic total occlusions located 1 cm from the CMUT array.Yayın Coherent-array imaging using phased subarrays. Part I: Basic principles(IEEE-INST Electrical Electronics Engineers Inc, 2005-01) Johnson, Jeremy A.; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasThe front-end hardware complexity of a coherent array imaging system scales with the number of active array elements that are simultaneously used for transmission or reception of signals. Different imaging methods use different numbers of active channels and data collection strategies. Conventional full phased array (EPA) imaging produces the best image quality using all elements for both transmission and reception, and it has high front-end hardware complexity. In contrast, classical synthetic aperture (CSA) imaging only transmits on and receives from a single element at a time, minimizing the hardware complexity but achieving poor image quality. We propose a new coherent array imaging method-phased subarray (PSA) imagine-that performs partial transmit and receive beam-forming using a subset of adjacent elements at each firing step. This method reduces the number of active channels to the number of subarray elements; these channels are multiplexed across the full array and a reduced number of beams are acquired from each subarray. The low-resolution subarray images are laterally upsampled, interpolated, weighted, and coherently summed to form the final high-resolution PSA image. The PSA imaging reduces the complexity of the front-end hardware while achieving image quality approaching that of FPA imaging.
