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Yayın An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging(IEEE-INST Electrical Electronics Engineers Inc, 2009-10) Wygant, Ira O.; Jamal, Nafis S.; Lee, Hyunjoo J.; Nikoozadeh, Amin; Oralkan, Ömer; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasState-of-the-art 3-D medical ultrasound imaging requires transmitting and receiving ultrasound using a 2-D array of ultrasound transducers with hundreds or thousands of elements. A tight combination of the transducer array with integrated circuitry eliminates bulky cables connecting the elements of the transducer array to a separate system of electronics. Furthermore, preamplifiers located close to the array can lead to improved receive sensitivity. A combined IC and transducer array can lead to a portable, high-performance, and inexpensive 3-D ultrasound imaging system. This paper presents an IC flip-chip bonded to a 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array for 3-D ultrasound imaging. The IC includes a transmit beamformer that generates 25-V unipolar pulses with programmable focusing delays to 224 of the 256 transducer elements. One-shot circuits allow adjustment of the pulse widths for different ultrasound transducer center frequencies. For receiving reflected ultrasound signals, the IC uses the 32-elements along the array diagonals. The IC provides each receiving element with a low-noise 25-MHz-bandwidth transimpedance amplifier. Using a field-programmable gate array (FPGA) clocked at 100 MHz to operate the IC, the IC generated property timed transmit pulses with 5-ns accuracy. With the IC flip-chip bonded to a CMUT array, we show that the IC can produce steered and focused ultrasound beams. We present 2-D and 3-D images of a wire phantom and 2-D orthogonal cross-sectional images (B-scans) of a latex heart phantom.Yayın Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging(IEEE-INST Electrical Electronics Engineers Inc, 2008-02) Wygant, Ira O.; Zhuang, Xuefeng; Yeh, David T.; Oralkan, Ömer; Ergün, Arif Sanlı; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasFor three-dimensional (3D) ultrasound imaging, connecting elements of a two-dimensional (2D) transducer array to the imaging system's front-end electronics is a challenge because of the large number of array elements and the small element size. To compactly connect the transducer array with electronics, we flip-chip bond a 2D 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array to a custom-designed integrated circuit (IC). Through-wafer interconnects are used to connect the CMUT elements on the top side of the array with flip-chip bond pads on the back side. The IC provides a 25-V pulser and a transimpedance preamplifier to each element of the array. For each of three characterized devices, the element yield is excellent (99 to 100% of the elements are functional). Center frequencies range from 2.6 MHz to 5.1 MHz. For pulse-echo operation, the average -6-dB fractional bandwidth is as high as 125%. Transmit pressures normalized to the face of the transducer are as high as 339 kPa and input-referred receiver noise is typically 1.2 to 2.1 mPa/root Hz. The flip-chip bonded devices were used to acquire 3D synthetic aperture images of a wire-target phantom. Combining the transducer array and IC, as shown in this paper, allows for better utilization of large arrays, improves receive sensitivity, and may lead to new imaging techniques that depend on transducer arrays that are closely coupled to IC electronics.Yayın The survey on Near Field Communication(MDPI, 2015-06) Coşkun, Vedat; Özdenizci Köse, Büşra; Ok, KeremNear Field Communication (NFC) is an emerging short-range wireless communication technology that offers great and varied promise in services such as payment, ticketing, gaming, crowd sourcing, voting, navigation, and many others. NFC technology enables the integration of services from a wide range of applications into one single smartphone. NFC technology has emerged recently, and consequently not much academic data are available yet, although the number of academic research studies carried out in the past two years has already surpassed the total number of the prior works combined. This paper presents the concept of NFC technology in a holistic approach from different perspectives, including hardware improvement and optimization, communication essentials and standards, applications, secure elements, privacy and security, usability analysis, and ecosystem and business issues. Further research opportunities in terms of the academic and business points of view are also explored and discussed at the end of each section. This comprehensive survey will be a valuable guide for researchers and academicians, as well as for business in the NFC technology and ecosystem.Yayın Economic impacts of increased U.S. exports of natural gas: An energy system perspective(MDPI AG, 2016-05-25) Sarıca, Kemal; Tyner, Wallace E.With the recent shale gas boom, the U.S. is expected to have very large natural gas resources. In this respect, the key question is would it be better to rely completely on free market resource allocations which would lead to large exports of natural gas or to limit natural gas exports so that more could be used in the U.S.. After accounting for the cost of liquefying the natural gas and shipping it to foreign markets, the current price difference leaves room for considerable profit to producers from exports. In addition, there is a large domestic demand for natural gas from various sectors such as electricity generation, industrial applications, and the transportation sector etc. A hybrid modeling approach has been carried out using our version of the well-known MARket ALlocation (MARKAL)-Macro model to keep bottom-up model richness with macro effects to incorporate price and gross domestic product (GDP) feedbacks. One of the conclusion of this study is that permitting higher natural gas export levels leads to a small reduction in GDP (0.04%-0.17%). Higher exports also increases U.S. greenhouse gas (GHG) emissions and electricity prices (1.1%-7.2%). We also evaluate the impacts of natural gas exports in the presence of a Clean Energy Standard (CES) for electricity. In this case, the GDP impacts are similar, but the electricity and transport sector impacts are different.Yayın Internationalisation of R&D into Emerging Markets: Fiat's R&D in Brazil, Turkey and India(Elsevier Sci Ltd, 2014-02) Athreye, Suma; Tuncay Çelikel, Aslı; Ujjual, VandanaThe idea that competence-creating subsidiaries from emerging nations can contribute to and possibly renew sources of competitive advantage is an appealing one for managerial practice and policy. Many mature MNEs can look to exploit the technological and market capabilities of their more capable subsidiaries in order to tap into new sources of growth. Based on a case study of Fiat and three of its emerging market R&D subsidiaries, we show that successfully developing competence-creating subsidiaries is a difficult task. Not only do parent and subsidiary managements have different ideas of what is involved, but subsidiary technological capability and local resources do not fully explain new technology creation mandates. The success of overall product market strategies and the mode of entry also exercise important effects. Furthermore, in our case study we find that internal embeddedness is more crucial than external embeddedness in distinguishing a successful new technology creation mandate.
